EP1AGX20CF780C6N vs EP1AGX35CF780I6N 对比

详细并排对比 EP1AGX20CF780C6N 出自 Intel 和 EP1AGX35CF780I6N 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

Intel
EP1AGX35CF780I6N EP1AGX35CF780I6N - Arria GX FPGA, 33.5K LE, 780-BGA | Intel

EP1AGX35CF780I6N - Arria GX FPGA, 33.5K LE, 780-BGA | Intel

EP1AGX35CF780I6N ⚠ 最后一次采购

规格对比

参数 EP1AGX20CF780C6N EP1AGX35CF780I6N
品牌 Intel Intel
分类 FPGA & CPLD FPGA & CPLD
生命周期状态 Obsolete 最后采购期
库存状态 有库存 有库存
单价(USD) $38.95 $278.75
Family Arria GX Arria GX
Logic Elements 21,580 —
Logic Array Blocks (LABs) 1,079 33,520
Embedded Memory (bits) 1,229,184 —
User I/O Pins 341 —
Number of Transceivers 4 (integrated multi-gigabit) —
Max Transceiver Data Rate 3.125 Gbps —
Core Voltage 1.2 V 1.2 V
Process Technology 90 nm 90 nm
Speed Grade C6 (commercial) I6
Temperature Grade Commercial (0 C to +85 C) Industrial
Package Type FBGA-780 (29 x 29 mm, 1.0 mm pitch) —
安装类型 Surface Mount Surface Mount
Lead-Free / RoHS Lead free —
Configuration Modes PS, FPP, AS, JTAG —
Manufacturer — Intel (formerly Altera)
Device Series — EP1AGX35
Logic Elements (LE) — 33,250
Embedded Transceivers — Up to 3.125 Gbps
Transceiver Count — [DATA_NEEDED: transceiver count for EP1AGX35 in F780 package]
封装 — 780-pin Flip-Chip BGA (FC-FBGA)
Package Code — BGA-780
Package Dimensions — 29 x 29 mm
Terminal Pitch — 1.00 mm
Terminal Form — Ball
Terminal Shape — [DATA_NEEDED: terminal shape - confirmed SQUARE package per partstack]
工作温度范围 — -40C to +100C (Industrial, I6 speed grade)
RoHS 状态 — [DATA_NEEDED: RoHS status not stated in verified sources]

数据手册与资源

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