EP1C4F324C7 vs EP1C4F324C6N Comparison
Detailed side-by-side comparison of EP1C4F324C7 by Intel and EP1C4F324C6N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EP1C4F324C7 | EP1C4F324C6N |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Obsolete | Active |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $46.80 | $24.95 |
| Device Type | FPGA (Field-Programmable Gate Array) | — |
| Series | Cyclone | — |
| Logic Elements | 4 000 | — |
| Logic Array Blocks / CLBs | 400 CLBs | — |
| Embedded Memory (Bits) | 78 336 | — |
| Maximum User I/O | 249 | — |
| Package | 324-FBGA, 19 × 19 mm, 1.0 mm pitch, lead-free | 324-ball FBGA, 19 x 19 mm, 1.0 mm pitch |
| Core Supply Voltage | 1.5 V | 1.5 V |
| Internal Frequency (max, family ref) | 405 MHz | — |
| Operating Temperature | Commercial (0 °C to +85 °C) inferred from speed grade C7 | 0C to +85C (commercial) |
| Configuration Modes | Passive Serial (PS), Active Serial (AS), JTAG | — |
| Mounting Type | Surface Mount (BGA) | — |
| Process Technology | CMOS, 130 nm-class (Cyclone generation) | 130 nm |
| RoHS Status | Compliant (lead-free FBGA) | — |
| MSL Level | 3 (per JEDEC J-STD-020, typical for BGA-324) | — |
| Device Family | — | Cyclone |
| Logic Elements (LE) | — | 4,000 |
| Logic Array Blocks (LAB) | — | 400 |
| Total RAM Bits | — | 78,336 |
| Embedded Multipliers (17x17) | — | 20 |
| M4K RAM Blocks | — | 17 |
| Maximum User I/Os | — | 249 |
| PLLs | — | 2 |
| Global Clock Networks | — | 8 |
| Internal Operating Frequency | — | 405 MHz |
| Configuration Method | — | SRAM-based, JTAG/Active Serial |