EP1C4F324C7 vs EP1C4F324C6N Comparación
Comparación detallada lado a lado de EP1C4F324C7 por Intel y EP1C4F324C6N por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP1C4F324C7 | EP1C4F324C6N |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Obsolete | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $46,80 | $24,95 |
| Device Type | FPGA (Field-Programmable Gate Array) | — |
| Series | Cyclone | — |
| Logic Elements | 4 000 | — |
| Logic Array Blocks / CLBs | 400 CLBs | — |
| Embedded Memory (Bits) | 78 336 | — |
| Maximum User I/O | 249 | — |
| Encapsulado | 324-FBGA, 19 × 19 mm, 1.0 mm pitch, lead-free | 324-ball FBGA, 19 x 19 mm, 1.0 mm pitch |
| Core Supply Voltage | 1.5 V | 1.5 V |
| Internal Frequency (max, family ref) | 405 MHz | — |
| Temperatura de funcionamiento | Commercial (0 °C to +85 °C) inferred from speed grade C7 | 0C to +85C (commercial) |
| Configuration Modes | Passive Serial (PS), Active Serial (AS), JTAG | — |
| Tipo de montaje | Surface Mount (BGA) | — |
| Process Technology | CMOS, 130 nm-class (Cyclone generation) | 130 nm |
| Estado RoHS | Compliant (lead-free FBGA) | — |
| Nivel MSL | 3 (per JEDEC J-STD-020, typical for BGA-324) | — |
| Device Family | — | Cyclone |
| Logic Elements (LE) | — | 4,000 |
| Logic Array Blocks (LAB) | — | 400 |
| Total RAM Bits | — | 78,336 |
| Embedded Multipliers (17x17) | — | 20 |
| M4K RAM Blocks | — | 17 |
| Maximum User I/Os | — | 249 |
| PLLs | — | 2 |
| Global Clock Networks | — | 8 |
| Internal Operating Frequency | — | 405 MHz |
| Configuration Method | — | SRAM-based, JTAG/Active Serial |