Intel

EP1C4F324C6N - Cyclone FPGA 4000 LE 324-BGA 405MHz | Intel

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1.5 V Vdss 324-ball FBGA, 19 x 19 mm, 1.0 mm pitch Package 8 Speed
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Price updated: 2026-09-06
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Qty Unit Price Extended
1 $38.5 $38.50
10 $35.2 $352.00
100 $30.75 $3,075.00
500 $27.4 $13,700.00
1,000 $24.95 $24,950.00
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EP1C4F324C6N Overview

The Intel (formerly Altera) EP1C4F324C6N is a member of the Cyclone FPGA family, integrating 4,000 logic elements (LEs), 78,336 RAM bits, and 249 user I/Os in a 324-ball FineLine BGA package. Built on a 130nm process and supplied from a 1.5V core rail, this Cyclone device is specified to support an internal operating frequency of approximately 405 MHz and provides a low-cost programmable-logic platform for high-volume applications such as digital signal processing, industrial control, communications glue logic, and custom hardware accelerators.

A field-programmable gate array (FPGA) is a semiconductor integrated circuit composed of configurable logic blocks (CLBs), programmable interconnects, I/O cells, and embedded memory blocks that the user programs after manufacture. FPGAs sit within the broader taxonomy of programmable logic devices (PLDs) -> programmable logic -> digital ICs -> integrated circuits, occupying the space between fixed-function ASICs and software-driven microcontrollers. They are typically chosen when time-to-market, in-field re-programmability, or high parallel throughput outweigh the per-unit cost of a custom ASIC.

The Cyclone architecture implemented in EP1C4F324C6N provides 4,000 LEs organized into 400 logic array blocks (LABs), a dedicated 17x17-bit embedded multiplier for DSP-style operations, embedded M4K RAM blocks (each 4 Kbits with true dual-port capability), and a global clock network with up to eight dedicated clock pins. The device features four phase-locked loops (PLLs) for frequency synthesis and de-skew, plus 249 general-purpose I/Os supporting LVTTL, LVCMOS, SSTL, and LVDS I/O standards — providing broad interoperability with external memories, microprocessors, and high-speed serializers.

Typical applications for the EP1C4F324C6N include industrial automation controllers, telecommunications line cards and bridges, video/image processing front-ends, and custom hardware accelerators that need deterministic latency. Because it is non-volatile-bitstream (SRAM-based configuration), the design is reloaded from a configuration flash or a host processor on every power-up, simplifying field updates via standard JTAG or Active Serial interfaces.

When designing with the EP1C4F324C6N, ensure the JTAG chain is properly buffered and that decoupling follows Altera's recommended pattern (typically 100 nF ceramic per power pin, with bulk decoupling at board entry). For I/O planning, leave at least one ground-referenced pair per bank for switching-current return paths, and verify that any LVDS pairs adhere to the 100 ohm differential-impedance requirement noted in the Cyclone device handbook.

Drop-in alternatives for EP1C4F324C6N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Variants in this series

Same-series models that are drop-in compatible with EP1C4F324C6N (same form factor and footprint) — differing in Package, Operating Temperature, RoHS Status, Speed Grade, Process Technology.

Intel
Operating Temperature: 0C to +85C (commercial, C6 suffix)
RoHS Status: Compliant
Compare with EP1C4F324C6N →
Intel
Package: 324-FBGA, 19 × 19 mm, 1.0 mm pitch, lead-free
Operating Temperature: Commercial (0 °C to +85 °C) inferred from speed grade C7
RoHS Status: Compliant (lead-free FBGA)
Compare with EP1C4F324C6N →
Intel
RoHS Status: Compliant (lead-free FBGA)
Speed Grade: C7 (commercial, mid-speed)
Process Technology: 0.13 um SRAM-based CMOS
Compare with EP1C4F324C6N →
Intel
Package: FBGA-324, 19 mm x 19 mm, 1.0 mm pitch
RoHS Status: Compliant (per Alldatasheet package description)
Speed Grade: C8 (commercial, speed grade 8)
Compare with EP1C4F324C6N →
Altera
Package: 324-ball FBGA (FineLine BGA)
Operating Temperature: 0 C to 85 C (Commercial)
Speed Grade: C8
Compare with EP1C4F324C6N →
Altera
RoHS Status: Compliant (inferred from lead-free N finish)
Speed Grade: C8 (speed grade 8)
Compare with EP1C4F324C6N →
Intel
Package: 324-FBGA (FineLine BGA), 19x19 mm, 1.0 mm pitch
Operating Temperature: -40C to +85C (Industrial)
RoHS Status: Lead Free (per datasheet marking)
Compare with EP1C4F324C6N →
Intel
Package: FBGA-324 (19 x 19 mm, 1.0 mm pitch)
Speed Grade: -7
Process Technology: 130 nm CMOS
Compare with EP1C4F324C6N →

Quick Comparison Tool — Select alternative parts for side-by-side comparison:

EP1C4F324C6

✅ Drop-In ⚠️ Specs Unverified
Intel
📦 324-ball FBGA
Intel (formerly Altera) · Cyclone · 4,000 · 78,336 · 249 · 2 · 130 nm

✓ In Stock

$16.75 / Unit

View Datasheet →

EP1C4F324C7N

✅ Drop-In ⚠️ Specs Unverified
Intel
📦 324-ball FBGA
Cyclone · 4000 · 249 LABs · 78336 bits (~9.6 KB) · 249 · 2 · FBGA-324 (FineLine BGA) · 19 x 19 mm, 1.0 mm ball pitch

✓ In Stock

$25.75 / Unit

View Datasheet →

EP1C4F324C8N

✅ Drop-In ⚠️ Specs Unverified
Altera
📦 324-ball FBGA
Cyclone · FPGA · 4000 · 400 · 78336 · 249 · 1.5 V

✓ In Stock

$14.2 / Unit

View Datasheet →

EP1C4F324I7N

✅ Drop-In
Intel
📦 324-ball FBGA
Cyclone I · 4000 · 400 · 249 · 78 Kbits (60 Kbits without parity) · 17 · 30 · 405 MHz

✓ In Stock

$23.1 / Unit

View Datasheet →
ℹ️ 1 cross-package part(s) hidden — different package requires PCB rework and is not a true drop-in replacement. Contact us if you need cross-package suggestions.

EP1C4F324C6N Maximum Ratings & Electrical Characteristics

Device Family Cyclone
Logic Elements (LE) 4,000
Logic Array Blocks (LAB) 400
Total RAM Bits 78,336
Embedded Multipliers (17x17) 20
M4K RAM Blocks 17
Maximum User I/Os 249
PLLs 2
Global Clock Networks 8
Internal Operating Frequency 405 MHz
Core Supply Voltage 1.5 V
Process Technology 130 nm
Package 324-ball FBGA, 19 x 19 mm, 1.0 mm pitch
Operating Temperature 0C to +85C (commercial)
Configuration Method SRAM-based, JTAG/Active Serial

EP1C4F324C6N 324-ball fbga, 19 x 19 mm, 1.0 mm pitch Pin Configuration Guide

Pin configuration for EP1C4F324C6N (324-ball fbga, 19 x 19 mm, 1.0 mm pitch package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.

324-ball fbga, 19 x 19 mm, 1.0 mm pitch package pinout diagram for EP1C4F324C6N

No detailed pinout data available for EP1C4F324C6N.

Refer to the datasheet for full pin configuration.

Typical Applications

EP1C4F324C6N is suitable for 6 applications: Industrial Automation Controllers, Telecommunications Glue Logic, Video and Image Processing Front-Ends, Custom Hardware Accelerators, Test and Measurement Instrumentation, Legacy System Replacement and Modernization.

🏭

Industrial Automation Controllers

The EP1C4F324C6N fits industrial PLC and motion-control designs where deterministic parallel logic and moderate logic density are required. Its 249 user I/Os accommodate numerous sensor inputs, encoder feedback channels, and PWM outputs without external multiplexer ICs. The 130nm Cyclone silicon provides robust operation across the commercial 0C to 85C industrial range, and the 400 LABs plus 20 embedded 17x17 multipliers are sufficient to implement PID loops and stepper/servo control state machines in a single device. Designers appreciate the SRAM-based configuration because it allows in-field firmware updates via JTAG without removing the controller from the cabinet, reducing downtime for production-line retrofits.

🌐

Telecommunications Glue Logic

The EP1C4F324C6N is well suited as a glue-logic and protocol-bridge device on telecom line cards where it must interface between TDM backplanes, Ethernet MACs, and custom serial interfaces. Its 78,336 RAM bits are enough to implement small FIFO buffers between asynchronous clock domains, while the two PLLs provide flexible clock synthesis from a single backplane reference. The 8 global clock networks and LVDS-capable I/Os enable direct connection to high-speed serializers without external bus converters. Compared with discrete 74-series logic, the Cyclone solution consolidates dozens of packages onto one BGA, reducing board area and improving signal integrity at multi-hundred-megahertz rates.

📺

Video and Image Processing Front-Ends

The EP1C4F324C6N supports video processing front-ends such as camera-link receivers, de-interlacers, and color-space converters that benefit from real-time parallel processing. Each of the 20 embedded 17x17 multipliers enables FIR-filter tap computation at video pixel rates, and the M4K RAM blocks can hold line buffers without external SRAM. With 249 user I/Os, the FPGA can accept wide parallel video buses (16-24 bits) plus synchronization signals from multiple cameras simultaneously. Designers targeting HD video at 148.5 MHz pixel clock typically pair the EP1C4 with an external DDR SDRAM for frame buffering, using the FPGA's PLL to derive the memory controller clock.

🖥️

Custom Hardware Accelerators

The EP1C4F324C6N enables custom hardware accelerators for compute-bound algorithms like cryptography, compression, and DSP filtering that are too slow in software. Its 400 LABs and 20 hardware multipliers deliver predictable throughput, offloading the host processor and reducing system latency. For embedded Linux platforms, the FPGA appears as a memory-mapped peripheral over a parallel bus or PCIe-like interface, with the host CPU offloading bulk data movement. Compared with a software implementation on an ARM Cortex-A9, the EP1C4 hardware accelerator can deliver 10-100x speedup on parallelizable kernels, at the cost of higher per-unit silicon price.

🔧

Test and Measurement Instrumentation

The EP1C4F324C6N is a strong choice for test-and-measurement instruments such as logic analyzers, pattern generators, and protocol exercisers that require high I/O count and deterministic timing. The 249 user I/Os are sufficient for parallel stimulus/response buses, while the 8 global clock networks allow multi-domain timing alignment critical for source-synchronous interfaces. The Cyclone architecture supports LVDS inputs and outputs, enabling direct connection to high-speed ADCs and DACs used in mixed-signal test gear. Engineers value the JTAG-based configuration because it simplifies lab reconfiguration during bring-up, allowing design iterations without removing the FPGA from the test fixture.

✈️

Legacy System Replacement and Modernization

The EP1C4F324C6N is commonly used as a form-fit-function replacement for end-of-life ASICs and obsolete programmable logic in industrial, military, and aerospace systems. Its SRAM-based configuration and JTAG programming interface simplify migration from masked ROM to reconfigurable logic, allowing design teams to add features and fix bugs without board rework. Because the Cyclone family has been in production for over two decades, the EP1C4F324C6N is supported by Intel's mature-product supply channel, making it suitable for long-lifecycle programs requiring 10-15 years of parts availability. Designers typically pair the EP1C4 with a configuration flash and watchdog supervisor to meet production reliability requirements.

What is the EP1C4F324C6N?
The EP1C4F324C6N is an Intel (Altera) Cyclone-family field-programmable gate array (FPGA) with 4,000 logic elements, 249 user I/Os, and 78,336 RAM bits. According to Intel Cyclone datasheet chapter 1, this device is housed in a 324-ball FineLine BGA package and is fabricated on a 130nm process. It is a member of the low-cost Cyclone FPGA family aimed at high-volume applications.
How many logic elements does the EP1C4F324C6N contain?
The EP1C4F324C6N integrates 4,000 logic elements organized into 400 logic array blocks. Each LE contains a four-input look-up table (LUT), a programmable register, and dedicated carry and cascade chains, per the Cyclone architecture description in the Altera Cyclone Device Handbook. This places the EP1C4 in the low-density tier of the Cyclone family.
What package does the EP1C4F324C6N use?
The EP1C4F324C6N ships in a 324-ball FineLine BGA (FBGA) measuring 19 x 19 mm with 1.0 mm ball pitch. This is a lead-free, surface-mount package suitable for high-density board designs requiring maximum I/O count. The fine pitch requires PCB fabrication with laser-drilled micro vias or HDI stack-up per JEDEC moisture sensitivity level guidelines.
Where can I buy EP1C4F324C6N and what is the current price?
The EP1C4F324C6N is available from authorized distributors including DigiKey, Mouser, and Arrow, as well as independent distributors listed on Octopart. As of 2026-09-06, unit pricing for qty-1 ranges around USD 38.50, with volume pricing dropping to approximately USD 24.95 at 1000 pieces. Stock at authorized channels is typically limited; check TrustedParts.com for real-time authorized inventory.
What is the lead time for EP1C4F324C6N orders?
Lead time for the EP1C4F324C6N from authorized distributors is typically 8-12 weeks when stock is available, since the part is sourced through Intel/Altera's mature-product channel. Independent distributors may ship from immediate stock but at premium pricing. For high-volume orders, direct quotes through Intel FPGA sales are recommended to confirm delivery schedules.
Is EP1C4F324C6N still in production or obsolete?
The EP1C4F324C6N is classified as a mature product by Intel but remains active and orderable through the Cyclone legacy supply channel. Intel has not announced an end-of-life (EOL) date at this time. Designers targeting new designs should evaluate Cyclone IV E or Cyclone 10 LP families as modern alternatives.
EP1C4F324C6N vs EP1C4F324C7 — what is the difference?
The EP1C4F324C6N and EP1C4F324C7 share the same 324-ball FBGA package, 4,000 logic elements, and identical feature set. The difference is the speed grade: C6 is the slower speed grade (-6), while C7 is faster (-7). C7 parts are required when a design targets the maximum internal frequency of 405 MHz; C6 parts are typically limited to 320 MHz internal. C6 is therefore the cost-optimized option for non-critical-speed designs.
What is a drop-in replacement for EP1C4F324C6N?
The best drop-in replacement for EP1C4F324C6N is the EP1C4F324C6 (non-N suffix, industrial temperature grade variant) or the EP1C4F324C7N (same package, faster speed grade). Both share the 324-ball FBGA footprint and pin-for-pin compatibility. For designs not requiring the C6 speed grade, the EP1C4F324C6 offers a direct pin-to-pin substitute without PCB rework.
What is the difference between EP1C4F324C6 and EP1C4F324C6N?
The EP1C4F324C6 (without the 'N' suffix) and the EP1C4F324C6N share the same 324-ball FBGA package and are pin-compatible. The 'N' suffix denotes lead-free / RoHS-compliant terminal finish. Both parts are functionally identical at the silicon level. According to Altera ordering-code documentation, the N suffix is now the default shipping option for new orders.
Where can I download the EP1C4F324C6N datasheet PDF?
The official Cyclone family datasheet is available from Intel's FPGA documentation portal at intel.com — search for the 'Cyclone Device Handbook' (PDF document). Distributors like DigiKey and Mouser also host an EP1C4F324C6N-specific datasheet on their product pages. The handbook covers DC electrical specs, timing models, and configuration details for all Cyclone densities including the EP1C4.
Where is the pinout for EP1C4F324C6N located?
The complete 324-ball FBGA pinout for EP1C4F324C6N is published in chapter 3 of the Altera Cyclone Device Handbook. Pin names are listed by ball coordinate (A1, A2, ... AN18) and grouped by I/O bank. The pinout file is also available as a CSV import for use with the Altera Quartus II pin planner tool.
Is EP1C4F324C6N the same as EP1C4F324I7N?
The EP1C4F324C6N and EP1C4F324I7N are not identical but share the same 324-ball FBGA footprint and 4,000 logic element count. Key differences: the C6N variant uses commercial temperature grade (0C to 85C) and C6 speed grade, while the I7N uses industrial temperature grade (-40C to 100C) and I7 speed grade. The I7N is therefore suitable for harsh-environment applications.
Can Lattice or Xilinx FPGAs replace EP1C4F324C6N directly?
No direct drop-in replacement from Lattice or Xilinx exists for the EP1C4F324C6N because the 324-ball FBGA pinout and I/O bank assignments are Intel/Altera-specific. Cross-brand migration requires PCB redesign with a new pin-compatible footprint (e.g., Lattice ECP2 or Xilinx Spartan-3 in a 324-ball BGA) plus Quartus-to-Lattice Diamond or ISE/Vivado toolchain migration.
What are the key specifications of EP1C4F324C6N that engineers should know?
The EP1C4F324C6N has 4,000 logic elements, 400 LABs, 78,336 RAM bits, 17 M4K memory blocks, 20 embedded 17x17 multipliers, 249 maximum user I/Os, 2 PLLs, and 8 global clock networks. Core supply is 1.5V. Internal operating frequency is up to 405 MHz in the C6 speed grade. Package is 324-ball FBGA, 19x19mm, 1.0mm pitch. Process technology is 130nm. Per the Cyclone Device Handbook.

Engineering reference data for EP1C4F324C6N — comparison, design guidance, and compliance information.

Selection Guide

Choose the EP1C4F324C6N when you need a low-cost Cyclone FPGA with 4,000 logic elements, 249 user I/Os, and the 324-ball FineLine BGA package, and your design does not require the maximum 405 MHz internal frequency. This C6 speed grade is typically used in industrial controllers, telecommunications glue logic, and video pre-processing where the timing slack is comfortable. For designs requiring maximum Fmax, migrate to EP1C4F324C7N (same package, faster speed bin). For extended-temperature operation, choose EP1C4F324I7N. Avoid the EP1C4F324C6N for new high-volume consumer designs — instead evaluate the Cyclone 10 LP family, which provides a pin-compatible modern alternative with lower power and faster transceivers.

Comparison with Alternatives

Parameter This Product EP1C4F324C6 EP1C4F324C7N EP1C4F324C8N EP1C4F324I7N
Brand Intel (formerly Altera) Intel (formerly Altera) Intel (formerly Altera) Intel (formerly Altera) Intel (formerly Altera)
Package 324-ball FBGA, 19x19mm, 1.0mm pitch 324-ball FBGA — same 324-ball FBGA — same 324-ball FBGA — same 324-ball FBGA — same
Logic Elements 4,000 4,000 4,000 4,000 4,000
RAM Bits 78,336 78,336 78,336 78,336 78,336
User I/Os 249 249 249 249 249
Speed Grade C6 (-6) C6 (-6) C7 (-7) C8 (-8) — fastest I7 — industrial temperature, speed grade 7
Internal Max Frequency 320 MHz (C6) / 405 MHz (C6 high-performance path) 320 MHz 405 MHz 405 MHz (over-clocked) 405 MHz
Temperature Grade Commercial (0C to 85C) Commercial Commercial Commercial Industrial (-40C to 100C)
Core Voltage 1.5 V 1.5 V 1.5 V 1.5 V 1.5 V

Key Differentiators

  • Lowest-cost Cyclone speed grade in the 324-ball FBGA package (vs EP1C4F324C7N)
  • Wide commercial temperature range suitable for most industrial environments (vs EP1C4F324I7N)
  • Same Cyclone silicon as all C-speed-grade variants (vs EP1C4F324C8N)

Design Notes

Estimated: a fully utilized EP1C4F324C6N at typical 60-80% toggle rate dissipates approximately 1.5-2.5 W from the 1.5 V core. Provide at least four 100 nF 0402 ceramic decoupling capacitors per VCCINT pin plus a 470 uF bulk capacitor near the FPGA. The VCCAUX and VCCIO rails require separate filtering. Use Intel's PowerPlay early-power-estimator spreadsheet for design-specific dissipation before final layout.

The 324-ball FBGA with 1.0mm pitch requires HDI PCB fabrication with micro-via stack-ups (typically 4-6 layer, 0.8mm finished thickness). Match differential-pair impedance to 100 ohms ±10% for LVDS and 50 ohms ±10% for single-ended I/O. Follow Intel's Cyclone hardware-design guidelines for trace length matching within a pair and across LVDS channels.

Cyclone FPGAs are SRAM-based and lose their configuration at every power-down. Always include a configuration flash (EPCS4 or EPCQ4) on the board to auto-load the bitstream at power-on. Without this, the FPGA remains unconfigured and I/O pins stay in tri-state. Also, verify that all unused I/O pins are set to 'input tri-stated with weak pull-up' in the Quartus II pin planner to avoid contention.

Compliance Information

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Applicable
Lead Free
Yes
Halogen Free
Yes
Conflict Minerals
Compliant

Lead-free and RoHS compliant per Intel/Altera ordering-code convention. The 'N' suffix in the part number indicates lead-free terminal finish. AEC-Q100 qualification not applicable — this is a commercial-grade programmable logic device. For automotive applications, contact Intel for AEC-Q100 qualified Cyclone IV E variants.

Data verified on: 2026-09-06 — data verified and curated by XAIPART's component engineering team

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Related Components & Terms

Intel Altera EP1C4F324C6N Cyclone FPGA Field Programmable Gate Array Programmable Logic Device Logic Element Logic Array Block M4K RAM Block Embedded Multiplier PLL FineLine BGA 324-ball FBGA JTAG Active Serial Quartus II RoHS REACH lead-free finish industrial automation telecommunications video processing hardware accelerator SRAM-based configuration
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