EP1K100FI256-3 vs EP1K100FI256-2N Comparison

Detailed side-by-side comparison of EP1K100FI256-3 by Intel and EP1K100FI256-2N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EP1K100FI256-3 EP1K100FI256-2N
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Last Time Buy Obsolete
Family ACEX 1K ACEX 1K
Device Logic Elements 4,992 —
Typical Gate Count 100,000 gates —
Maximum RAM Bits 49,152 bits —
User I/O Pins 186 —
Dedicated Inputs 6 —
Speed Grade -3 -2 (faster bin)
Nominal Core Voltage 2.5 V —
Core Voltage Range 2.375 V to 2.625 V —
Process Technology 0.22 micron CMOS 0.22 µm CMOS
Operating Temperature Range -40 C to +85 C (Industrial) —
Package 256-ball FineLine BGA (FBGA-256) 256-ball FineLine BGA (FBGA-256)
Mounting Type Surface Mount Surface Mount
Configuration Method SRAM-based, JTAG / PS / AS supported —
RoHS Status [DATA_NEEDED: RoHS status] Non-compliant (leaded 'N' ball finish)
Lead-Free [DATA_NEEDED: lead-free status] —
AEC-Q100 Qualification Not qualified —
MSL Level [DATA_NEEDED: MSL level] —
JTAG Boundary Scan Yes (IEEE 1149.1) —
Series — EP1K100
Logic Elements — 4,992
System Gates — 100,000
Logic Array Blocks (LABs) — 624
Embedded Array Blocks (EABs) — 6
Total RAM Bits — 49,152
Maximum User I/O — 186
Core Supply Voltage — 2.5 V
I/O Supply Voltage — 2.5 V / 3.3 V / 5.0 V (MultiVolt)
Ball Finish — Leaded (SnPb) - 'N' suffix
Operating Temperature — -40 °C to +85 °C (Industrial)
Configuration Interface — JTAG (IEEE 1149.1) + serial modes

Datasheets & Resources

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