EP1K100FI256-3 vs EP1K100FI256-2N Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EP1K100FI256-3 sa pamamagitan ng Intel at EP1K100FI256-2N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Pagsanggunian na paghahambing

Parametro EP1K100FI256-3 EP1K100FI256-2N
Brand Intel Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle Huling Pagbili Obsolete
Family ACEX 1K ACEX 1K
Device Logic Elements 4,992 —
Typical Gate Count 100,000 gates —
Maximum RAM Bits 49,152 bits —
User I/O Pins 186 —
Dedicated Inputs 6 —
Speed Grade -3 -2 (faster bin)
Nominal Core Voltage 2.5 V —
Core Voltage Range 2.375 V to 2.625 V —
Process Technology 0.22 micron CMOS 0.22 µm CMOS
Hanay ng Temperature na Operasyon -40 C to +85 C (Industrial) —
Packhaging 256-ball FineLine BGA (FBGA-256) 256-ball FineLine BGA (FBGA-256)
Uri ng Pagpapasok Surface Mount Surface Mount
Configuration Method SRAM-based, JTAG / PS / AS supported —
Tindminan RoHS [DATA_NEEDED: RoHS status] Non-compliant (leaded 'N' ball finish)
Lead-Free [DATA_NEEDED: lead-free status] —
AEC-Q100 Qualification Not qualified —
Level ng MSL [DATA_NEEDED: MSL level] —
JTAG Boundary Scan Yes (IEEE 1149.1) —
Series — EP1K100
Logic Elements — 4,992
System Gates — 100,000
Logic Array Blocks (LABs) — 624
Embedded Array Blocks (EABs) — 6
Total RAM Bits — 49,152
Maximum User I/O — 186
Core Supply Voltage — 2.5 V
I/O Supply Voltage — 2.5 V / 3.3 V / 5.0 V (MultiVolt)
Ball Finish — Leaded (SnPb) - 'N' suffix
Temperature na Operasyon — -40 °C to +85 °C (Industrial)
Configuration Interface — JTAG (IEEE 1149.1) + serial modes

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