EP1K30FI256-2 vs EP1K30FC256-2 Comparison

Detailed side-by-side comparison of EP1K30FI256-2 by Intel and EP1K30FC256-2 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EP1K30FI256-2 EP1K30FC256-2
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Obsolete Obsolete
Family ACEX-1K ACEX-1K
Logic Elements (LEs) 1728 —
Typical Gate Count 30,000 gates —
Embedded RAM Bits 24,576 bits —
Logic Array Blocks (LABs) 216 —
User I/O Pins 171 171
Maximum Internal Frequency 200 MHz —
Process Technology 0.22 µm CMOS 0.22 µm CMOS
Core Supply Voltage (VCCINT) 2.375 V to 2.625 V (2.5 V typical) —
Package 256-ball FBGA 256-ball FineLine BGA (FBGA)
Mounting Type Surface Mount Surface Mount (BGA)
Operating Temperature -40 °C to +85 °C (Industrial) —
Speed Grade -2 -2
Configuration Interface JTAG / Serial / ByteBlaster —
RoHS Status [DATA_NEEDED: RoHS status not in verified web data] [DATA_NEEDED: RoHS compliance status]
Logic Elements — 1,728
Typical Gates — 30,000
Configurable Logic Blocks (CLBs) — 216
On-chip RAM Bits — 24,576
Core Voltage — 2.5 V
Pin Count — 256
Configuration Method — SRAM (volatile, serial PROM or JTAG)
JTAG Support — Yes (IEEE 1149.1 boundary scan)
Memory Type — Dual-port EAB blocks
Maximum Frequency — 200 MHz
Operating Temperature Grade — Commercial

Datasheets & Resources

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