EP1K50FC256-2N vs EP1K50FC256-1N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP1K50FC256-2N sa pamamagitan ng Intel at EP1K50FC256-1N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP1K50FC256-2N | EP1K50FC256-1N |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Obsolete | Obsolete |
| Family | ACEX-1K | ACEX-1K |
| Logic Elements (LEs) | 2,880 | — |
| Typical Gates | 50,000 | 50,000 |
| Embedded Memory (bits) | 40,960 | — |
| Embedded Array Blocks (EABs) | 10 | — |
| Logic Array Blocks (LABs) | 360 | 360 |
| Maximum User I/O Pins | 186 | — |
| Core Voltage (VCCINT) | 2.5 V (2.375 V to 2.625 V) | — |
| Temperature na Operasyon | 0 °C to 70 °C (Commercial) | 0 C to 70 C (commercial) |
| Process Technology | 0.22 µm CMOS SRAM | 0.22 um CMOS |
| Speed Grade | -2 | -1 (commercial) |
| Packhaging | 256-ball FBGA (FineLine BGA) | 256-ball FBGA (FineLine BGA) |
| Package Dimensions | 16 x 16 mm | — |
| Configuration Method | JTAG / Passive Serial | SRAM-based, JTAG (IEEE 1149.1) |
| Tindminan RoHS | [DATA_NEEDED: RoHS status] | Compliant |
| Uri ng Pagpapasok | Surface Mount (BGA) | Surface Mount |
| Series | — | ACEX-1K (2.5 V) |
| Maximum Logic Elements | — | 2,880 |
| Maximum System Gates | — | 199,000 |
| Embedded Memory (EAB) Bits | — | 40,960 bits |
| User I/O Pins | — | 186 |
| Core Supply Voltage | — | 2.5 V (2.375 V to 2.625 V) |
| Maximum Internal Frequency | — | 250 MHz |
| Typical Operating Current | — | 5 mA |
| Lead Status | — | Lead-free (-N suffix) |
| Programmable I/O Standards | — | LVTTL, LVCMOS, PCI, GTL+ |