EP1K50FI484-2N vs EP1K100FC484-2N Comparison

Detailed side-by-side comparison of EP1K50FI484-2N by Intel and EP1K100FC484-2N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EP1K50FI484-2N EP1K100FC484-2N
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Obsolete Last Time Buy
Family ACEX 1K ACEX-1K
Typical Gates 50,000 100,000
Logic Elements 2,880 4,992
Maximum Operating Frequency 200 MHz —
Process Technology 0.22 µm CMOS 0.22 µm SRAM
Core Voltage (VCCINT) 2.5 V —
I/O Voltage (VCCIO) 2.5 V / 3.3 V (MultiVolt) —
Embedded Memory (EAB) 40,960 bits 49,152 bits
User I/O Pins (max) 333 —
Package 484-pin FBGA (FineLine BGA) 484-ball FBGA
Operating Temperature -40 °C to +85 °C (industrial) [DATA_NEEDED: operating temperature range]
Programming Interface JTAG (IEEE 1149.1) / ByteBlaster —
Mounting Type Surface Mount Surface Mount
RoHS Status [DATA_NEEDED: RoHS compliance status] [DATA_NEEDED: non-leaded vs leaded suffix; -2N suffix indicates non-leaded per Altera naming]
Speed Grade -2 -2 (commercial)
Total Logic Elements (LE) 2,880 —
Maximum User I/O — 333
Core Voltage — 2.5 V
Configuration Method — SRAM, JTAG (IEEE 1149.1)
Programmable I/O Standards — LVTTL, LVCMOS, PCI, SSTL-2/3, GTL+
Lead Status — Contains lead (legacy non-Pb-free suffix -2N)

Datasheets & Resources

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