EP1K50XXB vs EP1K30FC256-2 Comparison

Detailed side-by-side comparison of EP1K50XXB by Intel and EP1K30FC256-2 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EP1K50XXB EP1K30FC256-2
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Obsolete Obsolete
Family ACEX-1K ACEX-1K
Manufacturer Intel (formerly Altera) —
Process Technology 0.18 um SRAM 0.22 µm CMOS
Typical Gates 50,000 30,000
Logic Elements (LEs) 2,880 —
Embedded System RAM Bits 40,960 —
Embedded Array Blocks (EABs) 10 (each 4 Kbit, configurable as RAM/ROM) —
Maximum User I/O [DATA_NEEDED: depends on package variant] —
Core Supply Voltage 2.5 V —
I/O Supply Voltage 3.3 V / 2.5 V / 1.8 V (multi-voltage) —
In-System Programmability Yes, via JTAG (IEEE 1149.1) —
Configuration Method Serial configuration device or JTAG SRAM (volatile, serial PROM or JTAG)
Operating Temperature Commercial 0C to +70C / Industrial -40C to +85C —
Package Type [DATA_NEEDED: depends on MPN suffix] —
RoHS Status Compliant (lead-free variants available) [DATA_NEEDED: RoHS compliance status]
Lifecycle Status Obsolete (NRND on legacy Altera roadmap) —
Logic Elements — 1,728
Configurable Logic Blocks (CLBs) — 216
On-chip RAM Bits — 24,576
User I/O Pins — 171
Speed Grade — -2
Core Voltage — 2.5 V
Package — 256-ball FineLine BGA (FBGA)
Pin Count — 256
JTAG Support — Yes (IEEE 1149.1 boundary scan)
Memory Type — Dual-port EAB blocks
Maximum Frequency — 200 MHz
Operating Temperature Grade — Commercial
Mounting Type — Surface Mount (BGA)

Datasheets & Resources

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