EP1K50XXB - ACEX-1K FPGA, 50K Gates, 2880 LEs | Intel
MPN: EP1K50XXB ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $18.5 | $18.50 |
| 10 | $16.2 | $162.00 |
| 100 | $14 | $1,400.00 |
| 500 | $12.3 | $6,150.00 |
| 1,000 | $10.9 | $10,900.00 |
Drop-in alternatives for EP1K50XXB — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP1K50FC256-2
✅ Drop-In✓ In Stock
$62 / Unit
View Datasheet →EP1K50QC208-2
✅ Drop-In✓ In Stock
$20.95 / Unit
View Datasheet →EP1K50TI144-2
✅ Drop-In✓ In Stock
$27.85 / Unit
View Datasheet →EP1K30FC256-2
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$22.95 / Unit
View Datasheet →EP1K100FC256-2
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$27.6 / Unit
View Datasheet →EP1K10FC256-2
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$9.95 / Unit
View Datasheet →EP1K50XXB Maximum Ratings & Electrical Characteristics
| Family | ACEX-1K |
| Manufacturer | Intel (formerly Altera) |
| Process Technology | 0.18 um SRAM |
| Typical Gates | 50,000 |
| Logic Elements (LEs) | 2,880 |
| Embedded System RAM Bits | 40,960 |
| Embedded Array Blocks (EABs) | 10 (each 4 Kbit, configurable as RAM/ROM) |
| Core Supply Voltage | 2.5 V |
| I/O Supply Voltage | 3.3 V / 2.5 V / 1.8 V (multi-voltage) |
| In-System Programmability | Yes, via JTAG (IEEE 1149.1) |
| Configuration Method | Serial configuration device or JTAG |
| Operating Temperature | Commercial 0C to +70C / Industrial -40C to +85C |
| RoHS Status | Compliant (lead-free variants available) |
| Lifecycle Status | Obsolete (NRND on legacy Altera roadmap) |
EP1K50XXB [data_needed: depends on mpn suffix] Pin Configuration Guide
Complete pinout information for EP1K50XXB ([data_needed: depends on mpn suffix] package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
![[data_needed: depends on mpn suffix] package pinout diagram for EP1K50XXB](/assets/package-diagrams/default.svg?v=1788622528)
No detailed pinout data available for EP1K50XXB.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP1K50XXB is suitable for 7 applications: Legacy Industrial Control and PLC Logic, Telecom Line Card Glue Logic and Bus Bridging, ASIC Prototyping and Verification, Digital Signal Processing Front-End, Legacy Peripheral and Storage Controller, Military and Avionics Legacy Systems, Educational and Development Boards.
Legacy Industrial Control and PLC Logic
The Intel EP1K50XXB's 2,880 logic elements and embedded array blocks provide the deterministic timing and parallel processing needed in legacy PLC and industrial control systems where deterministic response to interrupt lines is critical. At 50K typical gates with 40,960 bits of embedded RAM, the device can implement multiple state machines and FIFO buffers concurrently without software scheduling latency. Engineers use it for motor-control glue logic, encoder counters, and encoder/decoder interfaces, benefiting from JTAG in-system programmability for firmware updates in the field. The 2.5 V core and 3.3 V/2.5 V/1.8 V I/O banks allow direct connection to legacy 5 V-tolerant transceivers via external resistors. Industrial-grade -40C to +85C variants maintain timing closure on factory floors with temperature swings. Place the configuration EEPROM within 6 inches of the FPGA to meet setup-time requirements during power-up.
Recommended
Telecom Line Card Glue Logic and Bus Bridging
The EP1K50XXB's high I/O count and 50K-gate capacity make it well-suited for telecom line cards interfacing between legacy TDM buses, H.110 CT buses, and PCI/CompactPCI backplanes. Its 2.5 V core dissipates less power than 3.3 V predecessors while supporting 3.3 V PCI signaling on the I/O banks directly. Embedded array blocks implement small FIFOs and lookup tables for protocol conversion without external SRAM. Deterministic 10 ns-class pin-to-pin timing closes critical bus-arbitration windows in TDM switch fabrics. The device is widely deployed in legacy Class-5 switch line cards and ATM-to-PDSN adapters. Designers preserve the Quartus II HDL source and migrate only when forced by component obsolescence or end-customer EOL requirements.
Recommended
ASIC Prototyping and Verification
The EP1K50XXB is frequently used as an early-stage ASIC prototype where designers partition a target ASIC into FPGA-equivalent logic for RTL validation before committing to mask costs. With 2,880 logic elements, the device maps to roughly 25-35K ASIC gates depending on synthesis style and meets typical RTL sign-off coverage at 50-80 MHz system clock. Embedded array blocks host synthesis testbenches and BIST functions without external RAM. Engineers use JTAG-bound logic analyzers (SignalTap-style) for runtime waveform capture of internal nodes. The 0.18-micron SRAM process delivers predictable timing closure compared to LUT-only competitors. Use Quartus II 13.0sp1 as the final toolchain to maintain bitstream compatibility with deployed boards.
Recommended
Digital Signal Processing Front-End
The EP1K50XXB's 40,960 bits of embedded RAM across 10 EABs enable efficient implementation of FIR filters, correlators, and small FFT engines in DSP front-ends. Each EAB can be configured as dual-port RAM or ROM for coefficient storage and sample buffering, removing the need for external SRAM in many 16-tap-class designs. At 50K typical gates, the FPGA maps 8-bit and 12-bit datapaths in parallel without contention. The device is widely deployed in legacy audio mixers, sonar front-end boards, and radar timing extractors. Industrial-grade parts operate reliably in vibration-prone enclosures. Combine with an external 12-bit ADC for high-density multichannel acquisition where parallel sampling outperforms sequential microcontrollers.
Recommended
Legacy Peripheral and Storage Controller
The EP1K50XXB's 50K-gate capacity and embedded array blocks support custom peripheral controllers such as SCSI-to-IDE bridges, parallel ATA RAID adapters, and legacy floppy/tape controller cards. The EABs host microcode for command decoding while the logic elements implement state machines for DMA arbitration and bus handshaking. Multi-voltage I/O banks allow direct interfacing with both 5 V and 3.3 V peripherals via level shifting on the I/O pins. The device is JTAG-programmable in-circuit, enabling firmware updates without removing the board. Commercial and industrial temperature grades support desktop and embedded chassis. Plan migration to Cyclone IV or MAX 10 for any new peripheral card design due to ACEX-1K obsolescence.
Recommended
Military and Avionics Legacy Systems
The EP1K50XXB industrial and military temperature grade variants (EP1K50FI-series) deliver -40C to +85C operation with deterministic timing for avionics subsystems, ground-vehicle electronics, and naval communication systems. Long lifecycle programs (15-25 years) deployed EP1K50 designs during the early 2000s and continue to use them in sustainment phases. The device's SRAM fabric allows in-flight configuration updates while maintaining deterministic response on critical lines. Embedded array blocks host crypto look-up tables and protocol state tables. Lead-free packages meet modern RoHS requirements. Maintain a documented supply chain via independent distributors with traceability certificates for sustainment-phase procurement.
Recommended
Educational and Development Boards
The EP1K50XXB and its package variants are commonly deployed on university FPGA teaching boards and Altera/Intel legacy development kits, where students learn Verilog and VHDL synthesis on affordable, well-documented silicon. The 50K-gate capacity accommodates complete RISC core implementations (e.g., NIOS I) plus peripherals, making it ideal for computer-architecture coursework. Embedded array blocks host instruction cache and data memory without external SRAM. JTAG programming allows students to iterate rapidly without removing the chip. Many universities maintain legacy Altera Cyclone or ACEX-1K boards for continuity with established course material. Use Quartus II Web Edition 13.0sp1 as the free toolchain for educational settings.
Recommended
Recommended Products Summary
Engineering reference data for EP1K50XXB — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1K50FC256-2 | EP1K50QC208-2 | EP1K50TI144-2 | EP1K30FC256-2 | EP1K100FC256-2 |
|---|---|---|---|---|---|---|
| Family | ACEX-1K | ACEX-1K (same family) | ACEX-1K (same family) | ACEX-1K (same family) | ACEX-1K (same family, lower density) | ACEX-1K (same family, higher density) |
| Brand | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) |
| Package | [DATA_NEEDED: depends on suffix] | 256-pin FineLine BGA | 208-pin PQFP | 144-pin TQFP | 256-pin FineLine BGA | 256-pin FineLine BGA |
| Typical Gates | 50,000 | 50,000 | 50,000 | 50,000 | 30,000 | 100,000 |
| Logic Elements | 2,880 | 2,880 | 2,880 | 2,880 | 1,728 | 4,992 |
| Embedded RAM (bits) | 40,960 | 40,960 | 40,960 | 40,960 | 24,576 | 49,152 |
| Core Voltage | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V |
| Process Node | 0.18 um | 0.18 um | 0.18 um | 0.18 um | 0.18 um | 0.18 um |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
| Approx. Unit Price (qty 1) | USD 18.50 | USD 18-25 | USD 12-18 | USD 10-15 | USD 8-12 | USD 30-45 |
Key Differentiators
- Mid-density ACEX-1K with 2,880 LEs and 40 Kbit RAM (vs EP1K30FC256-2)
- Lower-density sweet spot vs EP1K100 many designs do not need (vs EP1K100FC256-2)
- Same ACEX-1K family silicon across all package variants (vs EP1K50FC256-2 vs EP1K50QC208-2 vs EP1K50TI144-2)
Design Notes
Estimated: EP1K50XXB at 100% resource utilization and 80 MHz operation draws approximately 200-300 mA from the 2.5 V VCCINT rail. Provide at least 4 layers with a dedicated ground plane and place 100 nF ceramic decoupling within 5 mm of every VCCINT pin. Industrial-grade parts may draw 20-30% more current at -40C; size the 2.5 V switching regulator or LDO for 400 mA headroom. Bulk 47 uF tantalum on the power entry point reduces switching transients during configuration.
All configuration pins (nCONFIG, nSTATUS, CONF_DONE, MSEL0/1, DCLK) require 4.7 kohm pull-up resistors to VCCIO unless using an Altera serial configuration device. Place the EPCS1/EPCS4 configuration EEPROM within 50 mm of the FPGA and route DCLK as a controlled-impedance 50 ohm trace. JTAG TCK must be screened from switching signals; add a 100 ohm series termination at the FPGA end. The JTAG chain supports 3.3 V TDO signaling; do not mix 1.8 V JTAG controllers without a level shifter.
Estimated: configuration time for a fully-utilized EP1K50XXB with an EPCS4 (4 Mbit) configuration device is approximately 60-100 ms during power-up; ensure downstream devices do not require ready signals before tCONFIG (default 100 ms). Do not drive user I/O during configuration; use the nSTATUS handshake to delay downstream logic. Also note that ACEX-1K SRAM fabric is volatile; loss of VCCINT erases the design. Always include a watchdog on mission-critical applications.
Estimated: at maximum toggle activity (100 MHz LVTTL on all I/Os, 80% LE utilization), the EP1K50XXB dissipates approximately 1-1.5 W. The FC256 BGA package has theta-JA of approximately 18 C/W, giving a junction-to-ambient rise of 18-27 C. Industrial temperature range is -40C to +85C ambient; ensure at least 0.5 square inches of inner-plane copper and thermal vias under the package to keep Tj below 100 C in enclosed chassis.
Multi-voltage I/O banks must be powered independently; VCCIO of an unpowered bank floats at undefined levels and may source current into a powered bank. Add 10 kohm pull-downs on unused I/O pins to prevent oscillation in noisy environments. For PCI-compliant 33 MHz operation, route 4-LVDS-class signals with 50 ohm microstrip and limit stub length to under 6 mm. Always reference the Quartus II 13.0sp1 timing analyzer reports for final pin assignments.
Compliance Information
RoHS-compliant lead-free packages available; REACH, halogen-free, and conflict-minerals statements not found in provided verified web data and marked unknown.
