EP1SGX25F672C7N vs EP1SGX25DF672C7N Comparison

Detailed side-by-side comparison of EP1SGX25F672C7N by Intel and EP1SGX25DF672C7N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EP1SGX25F672C7N EP1SGX25DF672C7N
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Obsolete Last Time Buy
Family Stratix GX —
Logic Elements 25,660 25,660
Configurable Logic Blocks (CLBs) 2,566 —
Embedded Memory (bits) 1,944,576 —
Number of I/O Banks 4 —
Maximum User I/O [DATA_NEEDED: max user I/O pins] 455
Number of Registers 25,660 —
Number of Transceivers Up to 20 4
Transceiver Data Rate 3.125 Gbps —
Operating Supply Voltage (Core) 1.5 V nominal —
Operating Temperature Range 0°C to 85°C (commercial) —
Process Technology CMOS 130 nm CMOS
Package 672-ball FineLine BGA (FBGA672), 1.00 mm pitch 672-ball FineLine BGA (FBGA-672)
Mounting Type Surface Mount Surface Mount (BGA)
MSL Level 3 —
RoHS Status Compliant (lead-free FBGA) Compliant
Series — Stratix GX
Embedded Memory — 1,944,576 bits
Transceiver Data Rate (Max) — 3.125 Gbps
Core Supply Voltage — 1.5 V
Operating Temperature — 0 °C to 85 °C (Commercial)
Package Dimensions — 33 × 33 mm, 1 mm pitch
Lead-Free / RoHS — Yes (lead-free, per datasheet)
Speed Grade — C7

Datasheets & Resources

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