EP1SGX25F672C7N vs EP1SGX25DF672C7N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP1SGX25F672C7N sa pamamagitan ng Intel at EP1SGX25DF672C7N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
EP1SGX25DF672C7N - Stratix GX FPGA 25K LE 672-BGA | Intel / Altera
EP1SGX25DF672C7N ⚠ Huling PagbiliPagsanggunian na paghahambing
| Parametro | EP1SGX25F672C7N | EP1SGX25DF672C7N |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Obsolete | Huling Pagbili |
| Family | Stratix GX | — |
| Logic Elements | 25,660 | 25,660 |
| Configurable Logic Blocks (CLBs) | 2,566 | — |
| Embedded Memory (bits) | 1,944,576 | — |
| Number of I/O Banks | 4 | — |
| Maximum User I/O | [DATA_NEEDED: max user I/O pins] | 455 |
| Number of Registers | 25,660 | — |
| Number of Transceivers | Up to 20 | 4 |
| Transceiver Data Rate | 3.125 Gbps | — |
| Operating Supply Voltage (Core) | 1.5 V nominal | — |
| Hanay ng Temperature na Operasyon | 0°C to 85°C (commercial) | — |
| Process Technology | CMOS | 130 nm CMOS |
| Packhaging | 672-ball FineLine BGA (FBGA672), 1.00 mm pitch | 672-ball FineLine BGA (FBGA-672) |
| Uri ng Pagpapasok | Surface Mount | Surface Mount (BGA) |
| Level ng MSL | 3 | — |
| Tindminan RoHS | Compliant (lead-free FBGA) | Compliant |
| Series | — | Stratix GX |
| Embedded Memory | — | 1,944,576 bits |
| Transceiver Data Rate (Max) | — | 3.125 Gbps |
| Core Supply Voltage | — | 1.5 V |
| Temperature na Operasyon | — | 0 °C to 85 °C (Commercial) |
| Package Dimensions | — | 33 × 33 mm, 1 mm pitch |
| Lead-Free / RoHS | — | Yes (lead-free, per datasheet) |
| Speed Grade | — | C7 |