EP20K400FI784-1 vs EP20K400FI784-3 Comparison

Detailed side-by-side comparison of EP20K400FI784-1 by Altera and EP20K400FI784-3 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EP20K400FI784-1 EP20K400FI784-3
Brand Altera Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Obsolete Obsolete
Stock Status In Stock In Stock
Unit Price (USD) $175.00 $155.00
Family APEX 20K APEX 20K
Series EP20K400 β€”
Device Type Loadable PLD (FPGA-class) β€”
Usable Gates 400,000 β€”
Logic Elements 1,560 [DATA_NEEDED: exact LE count]
Embedded Memory (EAB RAM) 212,992 bits β€”
Maximum User I/O 488 [DATA_NEEDED: user I/O count]
Maximum Internal Clock Frequency 6.1 GHz β€”
Package Type 784-ball Fine-pitch BGA (S-PBGA-B784) β€”
Mounting Type Surface Mount Surface Mount
Operating Junction Temperature -40Β°C to +100Β°C (industrial 'I') β€”
Supply Voltage - Core 1.8 V β€”
I/O Standards Supported 3.3 V / 5 V PCI, LVTTL, LVCMOS β€”
Dedicated Inputs 4 4
Process Technology 0.18 Β΅m CMOS, 6-layer metal 0.18 Β΅m CMOS SRAM
Boundary Scan JTAG IEEE 1149.1 β€”
Lead-Free / RoHS [DATA_NEEDED: RoHS status] β€”
Typical Gate Count β€” 400,000 gates
Embedded System Blocks (ESBs) β€” [DATA_NEEDED: ESB count]
Supply Voltage (Nominal) β€” 2.5 V
Supply Voltage Range β€” 2.375 V to 2.625 V
Speed Grade β€” -3 (slowest)
Operating Temperature β€” -40 Β°C to +100 Β°C (industrial)
Package β€” 784-ball PBGA (Fine-pitch BGA)
Package Code β€” BGA
Package Shape β€” Square
Terminal Pitch β€” 1.000 mm
Seated Height (max) β€” 2.7000 mm
Body Material β€” Plastic / Epoxy
MSL Level β€” 3
Configuration Method β€” SRAM (external EPROM required)
RoHS Status β€” [DATA_NEEDED: RoHS status]

Datasheets & Resources

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