EP20K400FI784-1 vs EP20K400FI784-3 Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EP20K400FI784-1 sa pamamagitan ng Altera at EP20K400FI784-3 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Pagsanggunian na paghahambing

Parametro EP20K400FI784-1 EP20K400FI784-3
Brand Altera Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle Obsolete Obsolete
Family APEX 20K APEX 20K
Series EP20K400 —
Device Type Loadable PLD (FPGA-class) —
Usable Gates 400,000 —
Logic Elements 1,560 [DATA_NEEDED: exact LE count]
Embedded Memory (EAB RAM) 212,992 bits —
Maximum User I/O 488 [DATA_NEEDED: user I/O count]
Maximum Internal Clock Frequency 6.1 GHz —
Package Type 784-ball Fine-pitch BGA (S-PBGA-B784) —
Uri ng Pagpapasok Surface Mount Surface Mount
Temperature ng Junction na Operasyon -40°C to +100°C (industrial 'I') —
Supply Voltage - Core 1.8 V —
I/O Standards Supported 3.3 V / 5 V PCI, LVTTL, LVCMOS —
Dedicated Inputs 4 4
Process Technology 0.18 µm CMOS, 6-layer metal 0.18 µm CMOS SRAM
Boundary Scan JTAG IEEE 1149.1 —
Lead-Free / RoHS [DATA_NEEDED: RoHS status] —
Typical Gate Count — 400,000 gates
Embedded System Blocks (ESBs) — [DATA_NEEDED: ESB count]
Supply Voltage (Nominal) — 2.5 V
Supply Voltage Range — 2.375 V to 2.625 V
Speed Grade — -3 (slowest)
Temperature na Operasyon — -40 °C to +100 °C (industrial)
Packhaging — 784-ball PBGA (Fine-pitch BGA)
Package Code — BGA
Package Shape — Square
Terminal Pitch — 1.000 mm
Seated Height (max) — 2.7000 mm
Body Material — Plastic / Epoxy
Level ng MSL — 3
Configuration Method — SRAM (external EPROM required)
Tindminan RoHS — [DATA_NEEDED: RoHS status]

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