EP2A15F672C7 vs EP2A25F1020C8ES Comparison
Detailed side-by-side comparison of EP2A15F672C7 by Intel and EP2A25F1020C8ES by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EP2A15F672C7 | EP2A25F1020C8ES |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Obsolete | Last Time Buy |
| Series | APEX II (EP2A15) | — |
| Family | APEX II FPGA | APEX II |
| Logic Elements (LE) | 16,640 | — |
| Total System Gates | 425,984 | — |
| Maximum User I/O | 492 | 735 |
| Embedded Memory Bits | 425,984 | — |
| Number of Macrocells / Logic Units | 16,640 | — |
| Propagation Delay (tPD) | 1.69 ns | — |
| Core Voltage | 1.5 V | — |
| Process Technology | 0.15 µm all-layer copper, up to 8 metal layers | [DATA_NEEDED: process node] |
| High-Speed I/O Standard | True-LVDS, LVPECL, PCML, HyperTransport | — |
| True-LVDS Data Rate | 1 Gbps | — |
| Package | 672-ball FineLine BGA (FCBGA) | 1020-ball FineLine BGA |
| Package Dimensions | 27 mm × 27 mm, 1.0 mm pitch | — |
| Mounting Type | Surface Mount | Surface Mount (BGA) |
| Operating Temperature | Commercial (0°C to +85°C) | — |
| Speed Grade | C7 | 8 |
| RoHS Status | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS status] |
| Logic Elements | — | 24,320 |
| System Gates | — | 2,750,000 |
| Embedded Memory (bits) | — | 622,592 |
| Package Code Suffix | — | F1020 |
| Temperature Grade | — | Commercial (0 C to +85 C) |
| Suffix Code | — | ES (Engineering Sample) |
| Core Voltage (VCCINT) | — | [DATA_NEEDED: VCCINT nominal] |
| MSL Level | — | 3 (168 Hours) |
| Packaging | — | Tray |