EP2A15F672C7 vs EP2A25F1020C8ES Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP2A15F672C7 disebabkan oleh Intel dan EP2A25F1020C8ES disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Intel
EP2A25F1020C8ES - APEX II 24K LE FPGA 1020-BBGA | Intel
EP2A25F1020C8ES ⚠ Bahagian terakhir untuk beliPengandingan Spesifikasi
| Parametr | EP2A15F672C7 | EP2A25F1020C8ES |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Obsolete | Masa Terakhir Dibeli |
| Series | APEX II (EP2A15) | — |
| Family | APEX II FPGA | APEX II |
| Logic Elements (LE) | 16,640 | — |
| Total System Gates | 425,984 | — |
| Maximum User I/O | 492 | 735 |
| Embedded Memory Bits | 425,984 | — |
| Number of Macrocells / Logic Units | 16,640 | — |
| Propagation Delay (tPD) | 1.69 ns | — |
| Core Voltage | 1.5 V | — |
| Process Technology | 0.15 µm all-layer copper, up to 8 metal layers | [DATA_NEEDED: process node] |
| High-Speed I/O Standard | True-LVDS, LVPECL, PCML, HyperTransport | — |
| True-LVDS Data Rate | 1 Gbps | — |
| Kemasan | 672-ball FineLine BGA (FCBGA) | 1020-ball FineLine BGA |
| Package Dimensions | 27 mm × 27 mm, 1.0 mm pitch | — |
| Jenis Pemasangan | Surface Mount | Surface Mount (BGA) |
| Suhu Operasi | Commercial (0°C to +85°C) | — |
| Speed Grade | C7 | 8 |
| Status RoHS | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS status] |
| Logic Elements | — | 24,320 |
| System Gates | — | 2,750,000 |
| Embedded Memory (bits) | — | 622,592 |
| Package Code Suffix | — | F1020 |
| Temperature Grade | — | Commercial (0 C to +85 C) |
| Suffix Code | — | ES (Engineering Sample) |
| Core Voltage (VCCINT) | — | [DATA_NEEDED: VCCINT nominal] |
| Aras MSL | — | 3 (168 Hours) |
| Packaging | — | Tray |