EP2A15F672C7 vs EP2A25F1020C8ES Comparación
Comparación detallada lado a lado de EP2A15F672C7 por Intel y EP2A25F1020C8ES por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP2A15F672C7 | EP2A25F1020C8ES |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Obsolete | Última compra |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $98,00 | $165,00 |
| Series | APEX II (EP2A15) | — |
| Family | APEX II FPGA | APEX II |
| Logic Elements (LE) | 16,640 | — |
| Total System Gates | 425,984 | — |
| Maximum User I/O | 492 | 735 |
| Embedded Memory Bits | 425,984 | — |
| Number of Macrocells / Logic Units | 16,640 | — |
| Propagation Delay (tPD) | 1.69 ns | — |
| Core Voltage | 1.5 V | — |
| Process Technology | 0.15 µm all-layer copper, up to 8 metal layers | [DATA_NEEDED: process node] |
| High-Speed I/O Standard | True-LVDS, LVPECL, PCML, HyperTransport | — |
| True-LVDS Data Rate | 1 Gbps | — |
| Encapsulado | 672-ball FineLine BGA (FCBGA) | 1020-ball FineLine BGA |
| Package Dimensions | 27 mm × 27 mm, 1.0 mm pitch | — |
| Tipo de montaje | Surface Mount | Surface Mount (BGA) |
| Temperatura de funcionamiento | Commercial (0°C to +85°C) | — |
| Speed Grade | C7 | 8 |
| Estado RoHS | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS status] |
| Logic Elements | — | 24,320 |
| System Gates | — | 2,750,000 |
| Embedded Memory (bits) | — | 622,592 |
| Package Code Suffix | — | F1020 |
| Temperature Grade | — | Commercial (0 C to +85 C) |
| Suffix Code | — | ES (Engineering Sample) |
| Core Voltage (VCCINT) | — | [DATA_NEEDED: VCCINT nominal] |
| Nivel MSL | — | 3 (168 Hours) |
| Packaging | — | Tray |