EP2A25B724-C7 vs EP2A40B724C7 Comparison

Detailed side-by-side comparison of EP2A25B724-C7 by Intel and EP2A40B724C7 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EP2A25B724-C7 EP2A40B724C7
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Obsolete Obsolete
Stock Status In Stock In Stock
Unit Price (USD) $195.00 $650.00
Family APEX II APEX II
Device EP2A25 β€”
System Gates 622,592 β€”
Logic Elements 24,320 β€”
User I/Os 540 β€”
Package 724-BBGA, FCBGA 724-ball FCBGA (FineLine BGA), 35 mm x 35 mm
Process Technology 0.15 Β΅m all-layer copper, up to 8 metal layers 0.15 Β΅m CMOS, up to 8 metal layers, all-layer copper
Core Voltage 1.5 V β€”
High-Speed Interface True-LVDS, LVPECL, PCML, HyperTransport up to 1 Gbps β€”
Embedded Memory (ESB) Configurable as 4 Kbit SRAM or product-term logic per ESB β€”
PLLs Up to 8 4
Multi-Voltage I/O 1.5 V / 1.8 V / 2.5 V / 3.3 V banks β€”
Speed Grade C7 β€”
Operating Temperature Commercial (0C to +85C) 0 Β°C to +85 Β°C (commercial)
Mounting Type Surface Mount Surface Mount (BGA)
RoHS Status [DATA_NEEDED: RoHS status] Non-compliant (lead-bearing FCBGA)
Logic Elements / Cells β€” 38,400
Total System Gates β€” 1,500,000
Embedded RAM Bits β€” 655,360
Maximum User I/O β€” 540
Core Supply Voltage β€” 1.425 V to 1.575 V (typ. 1.5 V)
Maximum Internal Frequency β€” 562 MHz
I/O Standards Supported β€” LVTTL, LVCMOS, 1.5 V/1.8 V/2.5 V/3.3 V, SSTL, HSTL, PCI, LVDS, LVPECL, PCML, HyperTransport, True-LVDS (1 Gbps)
Configuration Method β€” JTAG (IEEE 1149.1), Passive Serial, Passive Parallel, Active Serial via EPC configuration devices
MultiVolt I/O Support β€” 1.5 V, 1.8 V, 2.5 V, 3.3 V
DDR Memory Support β€” Yes (via ESB / I/O circuitry)
MSL Level β€” [DATA_NEEDED: MSL level]

Datasheets & Resources

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