EP2A40F672C9N vs EP2A40F672C8N Comparison

Detailed side-by-side comparison of EP2A40F672C9N by Intel and EP2A40F672C8N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EP2A40F672C9N EP2A40F672C8N
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Obsolete Obsolete
Stock Status In Stock In Stock
Unit Price (USD) $295.00 $122.00
Family APEX II APEX II
Device Name EP2A40 β€”
System Gates 1,500,000 1.5 M
Logic Elements 38,400 β€”
User I/Os 492 492
Embedded RAM (ESB) [DATA_NEEDED: ESB total RAM bits] β€”
Package BGA-672 (27 x 27 mm, 1.0 mm pitch) β€”
Package Code FC-FBGA / PBGA672 β€”
Speed Grade C9 (~1.55 ns propagation delay) C8
Process Technology 0.15 Β΅m all-layer copper, up to 8 metal layers β€”
Core Voltage 1.5 V β€”
Internal Frequency 366 MHz β€”
LVDS Data Rate 1 Gbps 1 Gbps
Propagation Delay 1.55 ns 1.55 ns
Operating Temperature 0 Β°C to +85 Β°C (commercial) β€”
Mounting Type Surface Mount β€”
Logic Family CMOS (SRAM-based configuration) CMOS
RoHS Status [DATA_NEEDED: RoHS compliance status] [DATA_NEEDED: RoHS status]
Series β€” EP2A40
Logic Elements / Cells β€” 38,400
Maximum Operating Frequency β€” 376 MHz
Technology Node β€” 0.15 Β΅m
Process Feature β€” All-layer copper, up to 8 metal layers
Nominal Supply Voltage (VCCINT) β€” 1.5 V
Supply Voltage Range β€” 1.425 V to 1.575 V
Number of Pins / Balls β€” 672
Package Type β€” FC-FBGA (FineLine BGA)
Package Dimensions β€” 27 x 27 mm
Ball Pitch β€” 1.0 mm
Embedded PLLs β€” 4
Programming Interface β€” JTAG (IEEE 1149.1)
Operating Temperature (Commercial) β€” 0 Β°C to 85 Β°C

Datasheets & Resources

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