EP2A40F672C9N vs EP2A40F672C8N Vergleich
Detaillierter Direktvergleich von EP2A40F672C9N von Intel und EP2A40F672C8N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP2A40F672C9N | EP2A40F672C8N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Obsolete | Obsolete |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $295,00 | $122,00 |
| Family | APEX II | APEX II |
| Device Name | EP2A40 | — |
| System Gates | 1,500,000 | 1.5 M |
| Logic Elements | 38,400 | — |
| User I/Os | 492 | 492 |
| Embedded RAM (ESB) | [DATA_NEEDED: ESB total RAM bits] | — |
| Gehäuse | BGA-672 (27 x 27 mm, 1.0 mm pitch) | — |
| Package Code | FC-FBGA / PBGA672 | — |
| Speed Grade | C9 (~1.55 ns propagation delay) | C8 |
| Process Technology | 0.15 µm all-layer copper, up to 8 metal layers | — |
| Core Voltage | 1.5 V | — |
| Internal Frequency | 366 MHz | — |
| LVDS Data Rate | 1 Gbps | 1 Gbps |
| Propagation Delay | 1.55 ns | 1.55 ns |
| Betriebstemperatur | 0 °C to +85 °C (commercial) | — |
| Montageart | Surface Mount | — |
| Logic Family | CMOS (SRAM-based configuration) | CMOS |
| RoHS-Status | [DATA_NEEDED: RoHS compliance status] | [DATA_NEEDED: RoHS status] |
| Series | — | EP2A40 |
| Logic Elements / Cells | — | 38,400 |
| Maximum Operating Frequency | — | 376 MHz |
| Technology Node | — | 0.15 µm |
| Process Feature | — | All-layer copper, up to 8 metal layers |
| Nominal Supply Voltage (VCCINT) | — | 1.5 V |
| Supply Voltage Range | — | 1.425 V to 1.575 V |
| Number of Pins / Balls | — | 672 |
| Package Type | — | FC-FBGA (FineLine BGA) |
| Package Dimensions | — | 27 x 27 mm |
| Ball Pitch | — | 1.0 mm |
| Embedded PLLs | — | 4 |
| Programming Interface | — | JTAG (IEEE 1149.1) |
| Operating Temperature (Commercial) | — | 0 °C to 85 °C |