EP2A40F672C9N vs EP2A40F672C8N Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EP2A40F672C9N sa pamamagitan ng Intel at EP2A40F672C8N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Pagsanggunian na paghahambing

Parametro EP2A40F672C9N EP2A40F672C8N
Brand Intel Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle Obsolete Obsolete
Family APEX II APEX II
Device Name EP2A40 —
System Gates 1,500,000 1.5 M
Logic Elements 38,400 —
User I/Os 492 492
Embedded RAM (ESB) [DATA_NEEDED: ESB total RAM bits] —
Packhaging BGA-672 (27 x 27 mm, 1.0 mm pitch) —
Package Code FC-FBGA / PBGA672 —
Speed Grade C9 (~1.55 ns propagation delay) C8
Process Technology 0.15 µm all-layer copper, up to 8 metal layers —
Core Voltage 1.5 V —
Internal Frequency 366 MHz —
LVDS Data Rate 1 Gbps 1 Gbps
Propagation Delay 1.55 ns 1.55 ns
Temperature na Operasyon 0 °C to +85 °C (commercial) —
Uri ng Pagpapasok Surface Mount —
Logic Family CMOS (SRAM-based configuration) CMOS
Tindminan RoHS [DATA_NEEDED: RoHS compliance status] [DATA_NEEDED: RoHS status]
Series — EP2A40
Logic Elements / Cells — 38,400
Maximum Operating Frequency — 376 MHz
Technology Node — 0.15 µm
Process Feature — All-layer copper, up to 8 metal layers
Nominal Supply Voltage (VCCINT) — 1.5 V
Supply Voltage Range — 1.425 V to 1.575 V
Number of Pins / Balls — 672
Package Type — FC-FBGA (FineLine BGA)
Package Dimensions — 27 x 27 mm
Ball Pitch — 1.0 mm
Embedded PLLs — 4
Programming Interface — JTAG (IEEE 1149.1)
Operating Temperature (Commercial) — 0 °C to 85 °C

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