EP2AGZ300FF35C3G vs EP2AGZ300FF35I4 Comparison

Detailed side-by-side comparison of EP2AGZ300FF35C3G by Intel and EP2AGZ300FF35I4 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EP2AGZ300FF35C3G EP2AGZ300FF35I4
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active Nrnd
Stock Status In Stock In Stock
Unit Price (USD) $1,395.00 $1,015.00
Series Arria II GZ β€”
Logic Elements 300,000 298,000
Adaptive Logic Modules (ALMs) 119,088 β€”
Embedded Memory 17,133 Kbit M20K blocks (distributed)
DSP Blocks 16-bit x 18-bit x 18-bit multipliers, integer/fractional modes Hard DSP columns (variable precision)
Transceivers 16 channels, up to 6.375 Gbps 12.5 Gbps integrated
Hard PCIe Controllers Up to 12 (Gen2 endpoint/root-port) β€”
User I/Os 1,288 β€”
I/O Banks 12 β€”
Process Technology 40 nm TSMC 40 nm
Package FCBGA-1152 (35 mm) 1152-ball FC-FBGA (FF35)
Package Family BGA (Flip-Chip) β€”
Temperature Grade Commercial (0 C to 85 C junction) Industrial (-40 C to +100 C)
Speed Grade 3 (mid-performance) β€”
Configuration Method Quartus II/Prime, JTAG, Passive Serial, Fast Passive Parallel β€”
Hard Memory Controller DDR3 up to 800 MHz, DDR2, QDR II+ β€”
RoHS Status Compliant Compliant
Family β€” Arria II GZ
Configurable Logic Blocks (LABs/CLBs) β€” 11,920
Maximum User I/O β€” 554
Operating Frequency (Max) β€” 500 MHz
Core Voltage β€” 0.9 V
Number of Pins/Balls β€” 1152
Terminal Form β€” Ball (BGA)
PCIe Support β€” PCIe Gen2 hard IP
Mounting Type β€” Surface Mount (flip-chip BGA)
Lead-Free β€” Yes

Datasheets & Resources

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