EP2AGZ300FF35C3G vs EP2AGZ300FF35I4 Vergleich

Detaillierter Direktvergleich von EP2AGZ300FF35C3G von Intel und EP2AGZ300FF35I4 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Spezifikationsvergleich

Parameter EP2AGZ300FF35C3G EP2AGZ300FF35I4
Marke Intel Intel
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus Aktiv NRND
Lagerstatus In Stock In Stock
Stückpreis (USD) $1.395,00 $1.015,00
Series Arria II GZ —
Logic Elements 300,000 298,000
Adaptive Logic Modules (ALMs) 119,088 —
Embedded Memory 17,133 Kbit M20K blocks (distributed)
DSP Blocks 16-bit x 18-bit x 18-bit multipliers, integer/fractional modes Hard DSP columns (variable precision)
Transceivers 16 channels, up to 6.375 Gbps 12.5 Gbps integrated
Hard PCIe Controllers Up to 12 (Gen2 endpoint/root-port) —
User I/Os 1,288 —
I/O Banks 12 —
Process Technology 40 nm TSMC 40 nm
Gehäuse FCBGA-1152 (35 mm) 1152-ball FC-FBGA (FF35)
Package Family BGA (Flip-Chip) —
Temperature Grade Commercial (0 C to 85 C junction) Industrial (-40 C to +100 C)
Speed Grade 3 (mid-performance) —
Configuration Method Quartus II/Prime, JTAG, Passive Serial, Fast Passive Parallel —
Hard Memory Controller DDR3 up to 800 MHz, DDR2, QDR II+ —
RoHS-Status Compliant Compliant
Family — Arria II GZ
Configurable Logic Blocks (LABs/CLBs) — 11,920
Maximum User I/O — 554
Operating Frequency (Max) — 500 MHz
Core Voltage — 0.9 V
Number of Pins/Balls — 1152
Terminal Form — Ball (BGA)
PCIe Support — PCIe Gen2 hard IP
Montageart — Surface Mount (flip-chip BGA)
Lead-Free — Yes

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