EP2AGZ350FH29C3G vs EP2AGZ350FH29C4G Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP2AGZ350FH29C3G disebabkan oleh Intel dan EP2AGZ350FH29C4G disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EP2AGZ350FH29C3G | EP2AGZ350FH29C4G |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Aktif | Aktif |
| Logic Elements | 350,000 | — |
| Adaptive Logic Modules (ALMs) | [DATA_NEEDED: ALM count] | — |
| Embedded Memory (Bits) | 16,402,944 | — |
| Embedded Memory Blocks | [DATA_NEEDED: M9K/M144K block count] | — |
| User I/O Pins | 281 | — |
| Transceivers | 24 channels | 16 (8.5 Gbps) |
| Transceiver Data Rate (max) | 8.5 Gbps | — |
| PCI Express Hard IP | 4 x PCIe Gen2 (x1/x4) | — |
| External Memory Interface | DDR3 up to 800 MHz, DDR2, QDRII+ | — |
| PLLs | 8 (4 enhanced, 4 fast) | — |
| Global Clocks | 16 | — |
| Process Node | 40 nm TSMC | 40 nm |
| Speed Grade | C3 (commercial, slowest) | C4 |
| Suhu Hubungan Operasi | 0C to +85C | — |
| Kemasan | 780-ball FBGA (HBGA, 29x29 mm) | 780-ball Flip-Chip BGA (FH29) |
| Jenis Pemasangan | Surface Mount | Surface Mount (BGA) |
| Status RoHS | Compliant | Compliant |
| Lead-Free | Yes | Yes |
| Aras MSL | [DATA_NEEDED: MSL rating] | — |
| Family | — | Arria II GZ |
| Logic Elements (LEs) | — | 350,000 |
| M20K Block RAM (bits) | — | 18,424 Kbits |
| MLAB Memory (bits) | — | 1,425 Kbits |
| Embedded Multipliers (18x18) | — | 1,152 |
| Maximum User I/O | — | 552 |
| Suhu Operasi | — | 0C to +85C (Commercial) |
| Transceiver Grade | — | -4 |