EP2AGZ350FH29C3G vs EP2AGZ350FH29C4G 比較
詳細並排比較 EP2AGZ350FH29C3G 由 Intel 與 EP2AGZ350FH29C4G 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
規格比較
| 參數 | EP2AGZ350FH29C3G | EP2AGZ350FH29C4G |
|---|---|---|
| 品牌 | Intel | Intel |
| 類別 | FPGA & CPLD | FPGA & CPLD |
| 生命週期狀態 | 啟用中 | 啟用中 |
| Logic Elements | 350,000 | — |
| Adaptive Logic Modules (ALMs) | [DATA_NEEDED: ALM count] | — |
| Embedded Memory (Bits) | 16,402,944 | — |
| Embedded Memory Blocks | [DATA_NEEDED: M9K/M144K block count] | — |
| User I/O Pins | 281 | — |
| Transceivers | 24 channels | 16 (8.5 Gbps) |
| Transceiver Data Rate (max) | 8.5 Gbps | — |
| PCI Express Hard IP | 4 x PCIe Gen2 (x1/x4) | — |
| External Memory Interface | DDR3 up to 800 MHz, DDR2, QDRII+ | — |
| PLLs | 8 (4 enhanced, 4 fast) | — |
| Global Clocks | 16 | — |
| Process Node | 40 nm TSMC | 40 nm |
| Speed Grade | C3 (commercial, slowest) | C4 |
| 工作接面溫度 | 0C to +85C | — |
| 封裝 | 780-ball FBGA (HBGA, 29x29 mm) | 780-ball Flip-Chip BGA (FH29) |
| 安裝類型 | Surface Mount | Surface Mount (BGA) |
| RoHS 狀態 | Compliant | Compliant |
| Lead-Free | Yes | Yes |
| MSL 等級 | [DATA_NEEDED: MSL rating] | — |
| Family | — | Arria II GZ |
| Logic Elements (LEs) | — | 350,000 |
| M20K Block RAM (bits) | — | 18,424 Kbits |
| MLAB Memory (bits) | — | 1,425 Kbits |
| Embedded Multipliers (18x18) | — | 1,152 |
| Maximum User I/O | — | 552 |
| 工作溫度 | — | 0C to +85C (Commercial) |
| Transceiver Grade | — | -4 |