EP2S180F1020C3 vs EP2S130F1020C3NGA Pengandingan
Pengandingan Sisi Kiri Sisi Kanan Terperinci EP2S180F1020C3 disebabkan oleh Intel dan EP2S130F1020C3NGA disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.
Pengandingan Spesifikasi
| Parametr | EP2S180F1020C3 | EP2S130F1020C3NGA |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Obsolete | NRND |
| Series | Stratix II | — |
| Device Family | EP2S180 | — |
| Equivalent Logic Elements (LEs) | 179,400 | — |
| Logic Array Blocks (LABs) | 8,970 | 6,627 |
| Embedded Memory (RAM bits) | 9,383,040 | — |
| Maximum User I/Os | 742 | — |
| Kemasan | 1020-ball FBGA (flip-chip BGA) | 1020-ball FC-FBGA |
| Jenis Pemasangan | Surface Mount | — |
| Process Node | 90 nm, all-layer copper SRAM | — |
| Core Voltage | 1.2 V | 1.2 V |
| Speed Grade | C3 | C3 |
| Suhu Operasi | Commercial (0C to +85C) | — |
| DSP Blocks | Dedicated high-speed multipliers | — |
| Memory Interfaces Supported | DDR2 SDRAM, QDRII SRAM, RLDRAM II | — |
| I/O Standards | LVDS, LVPECL, SSTL, HSTL | — |
| Configuration Method | SRAM-based (volatile, requires boot device) | — |
| Development Toolchain | Quartus II / Quartus Prime | — |
| Status RoHS | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: rohs status] |
| Family | — | Stratix II |
| Logic Elements (LE) | — | 132,540 |
| Embedded Memory (TriMatrix) | — | 6,747,840 bits (6.7 Mbits) |
| Embedded DSP Blocks | — | Yes (18x18 multiplier blocks) |
| User I/Os | — | 742 |
| Process Technology | — | 90 nm |
| Maximum Internal Clock Frequency | — | 778.82 MHz |
| Temperature Grade | — | Commercial (0C to +85C) |
| PLLs | — | 12 (8 fast PLLs + 4 enhanced PLLs) |
| Configuration Modes | — | PS, PPS, PPA, JTAG |
| Configuration Encryption | — | 128-bit AES |
| On-chip Termination (OCT) | — | Yes (series, parallel, dynamic) |