EP2S180F1020C3 vs EP2S130F1020C3NGA Perbandingan
Perbandingan bersamaan detil EP2S180F1020C3 dari Intel dan EP2S130F1020C3NGA dari Intel. Bandingkan spesifikasi penting, parameter listrik, pengemasan, status cycle, harga, dan ketersediaan untuk menentukan komponen terbaik untuk kebutuhan desain Anda.
Perbandingan Spesifikasi
| Parameter Umum | EP2S180F1020C3 | EP2S130F1020C3NGA |
|---|---|---|
| Merek | Intel | Intel |
| Kategori | FPGA & CPLD | FPGA & CPLD |
| Status Lingkungan Hidup | Obsolete | NRND |
| Series | Stratix II | — |
| Device Family | EP2S180 | — |
| Equivalent Logic Elements (LEs) | 179,400 | — |
| Logic Array Blocks (LABs) | 8,970 | 6,627 |
| Embedded Memory (RAM bits) | 9,383,040 | — |
| Maximum User I/Os | 742 | — |
| Paket | 1020-ball FBGA (flip-chip BGA) | 1020-ball FC-FBGA |
| Tipe Mounting | Surface Mount | — |
| Process Node | 90 nm, all-layer copper SRAM | — |
| Core Voltage | 1.2 V | 1.2 V |
| Speed Grade | C3 | C3 |
| Suhu Kerja | Commercial (0C to +85C) | — |
| DSP Blocks | Dedicated high-speed multipliers | — |
| Memory Interfaces Supported | DDR2 SDRAM, QDRII SRAM, RLDRAM II | — |
| I/O Standards | LVDS, LVPECL, SSTL, HSTL | — |
| Configuration Method | SRAM-based (volatile, requires boot device) | — |
| Development Toolchain | Quartus II / Quartus Prime | — |
| Status RoHS | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: rohs status] |
| Family | — | Stratix II |
| Logic Elements (LE) | — | 132,540 |
| Embedded Memory (TriMatrix) | — | 6,747,840 bits (6.7 Mbits) |
| Embedded DSP Blocks | — | Yes (18x18 multiplier blocks) |
| User I/Os | — | 742 |
| Process Technology | — | 90 nm |
| Maximum Internal Clock Frequency | — | 778.82 MHz |
| Temperature Grade | — | Commercial (0C to +85C) |
| PLLs | — | 12 (8 fast PLLs + 4 enhanced PLLs) |
| Configuration Modes | — | PS, PPS, PPA, JTAG |
| Configuration Encryption | — | 128-bit AES |
| On-chip Termination (OCT) | — | Yes (series, parallel, dynamic) |