EP2SGX30CF780C6 vs EP2SGX30CF780I4 Comparison
Detailed side-by-side comparison of EP2SGX30CF780C6 by Intel and EP2SGX30CF780I4 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EP2SGX30CF780C6 | EP2SGX30CF780I4 |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Nrnd | Nrnd |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $165.00 | $195.00 |
| Family | Stratix II GX | Stratix II GX |
| Series | EP2SGX | β |
| Logic Elements (LE) | 33,880 | β |
| Adaptive Logic Modules (ALM) | 13,540 | β |
| Embedded Memory Bits | 1,369,728 bits (171 KBytes) | β |
| Embedded Multiplier 18x18 | 64 (estimated, datasheet required for exact count) | β |
| User I/O Pins | 361 | β |
| High-Speed Transceivers | Up to 8 channels (FPGA-dependent configuration) | β |
| Transceiver Data Rate | Up to 6.375 Gbps | β |
| Package | 780-ball FineLine BGA (F780) | 780-ball FBGA (29 x 29 mm, 1.0 mm pitch) |
| Speed Grade | C6 (commercial, mid-speed) | β |
| Operating Temperature | 0C to +85C (commercial) | β |
| Core Voltage | 1.2 V (typical) | β |
| Configuration Mode | Enhanced passive/active (EPC) supported | β |
| Process Technology | 90 nm | 90 nm CMOS |
| RoHS Status | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS compliance status] |
| Lead-Free | [DATA_NEEDED: lead-free status] | [DATA_NEEDED: lead-free status] |
| Logic Elements | β | 33,880 |
| Logic Cells / CLBs | β | 33,880 |
| Maximum Internal Frequency | β | 622.08 MHz |
| Core Supply Voltage (VCCINT) | β | 1.15 V to 1.25 V |
| Operating Temperature Grade | β | Industrial (-40 Β°C to +85 Β°C) |
| Terminal Form | β | Ball (BGA) |
| Package Code | β | BGA (FineLine FBGA) |
| Number of Pins / Balls | β | 780 |
| Logic Family | β | CMOS |
| MSL Level | β | [DATA_NEEDED: MSL rating] |