EP2SGX30CF780C6 vs EP2SGX30CF780I4 Vergleich
Detaillierter Direktvergleich von EP2SGX30CF780C6 von Intel und EP2SGX30CF780I4 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP2SGX30CF780C6 | EP2SGX30CF780I4 |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | NRND | NRND |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $165,00 | $195,00 |
| Family | Stratix II GX | Stratix II GX |
| Series | EP2SGX | — |
| Logic Elements (LE) | 33,880 | — |
| Adaptive Logic Modules (ALM) | 13,540 | — |
| Embedded Memory Bits | 1,369,728 bits (171 KBytes) | — |
| Embedded Multiplier 18x18 | 64 (estimated, datasheet required for exact count) | — |
| User I/O Pins | 361 | — |
| High-Speed Transceivers | Up to 8 channels (FPGA-dependent configuration) | — |
| Transceiver Data Rate | Up to 6.375 Gbps | — |
| Gehäuse | 780-ball FineLine BGA (F780) | 780-ball FBGA (29 x 29 mm, 1.0 mm pitch) |
| Speed Grade | C6 (commercial, mid-speed) | — |
| Betriebstemperatur | 0C to +85C (commercial) | — |
| Core Voltage | 1.2 V (typical) | — |
| Configuration Mode | Enhanced passive/active (EPC) supported | — |
| Process Technology | 90 nm | 90 nm CMOS |
| RoHS-Status | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS compliance status] |
| Lead-Free | [DATA_NEEDED: lead-free status] | [DATA_NEEDED: lead-free status] |
| Logic Elements | — | 33,880 |
| Logic Cells / CLBs | — | 33,880 |
| Maximum Internal Frequency | — | 622.08 MHz |
| Core Supply Voltage (VCCINT) | — | 1.15 V to 1.25 V |
| Operating Temperature Grade | — | Industrial (-40 °C to +85 °C) |
| Terminal Form | — | Ball (BGA) |
| Package Code | — | BGA (FineLine FBGA) |
| Number of Pins / Balls | — | 780 |
| Logic Family | — | CMOS |
| MSL-Level | — | [DATA_NEEDED: MSL rating] |