EP2SGX30CF780C6 vs EP2SGX30CF780I4 مقارنة
مقارنة تفصيلية جنبًا إلى جنب لـ EP2SGX30CF780C6 بواسطة Intel و EP2SGX30CF780I4 بواسطة Intel. قارن المواصفات الرئيسية والمعلمات الكهربائية والتغليف وحالة دورة الحياة والأسعار والتوافر لتحديد أفضل مكوّن لمتطلبات تصميمك.
مقارنة المواصفات
| المعامل | EP2SGX30CF780C6 | EP2SGX30CF780I4 |
|---|---|---|
| العلامة التجارية | Intel | Intel |
| الفئة | FPGA & CPLD | FPGA & CPLD |
| حالة دورة الحياة | NRND | NRND |
| Family | Stratix II GX | Stratix II GX |
| Series | EP2SGX | — |
| Logic Elements (LE) | 33,880 | — |
| Adaptive Logic Modules (ALM) | 13,540 | — |
| Embedded Memory Bits | 1,369,728 bits (171 KBytes) | — |
| Embedded Multiplier 18x18 | 64 (estimated, datasheet required for exact count) | — |
| User I/O Pins | 361 | — |
| High-Speed Transceivers | Up to 8 channels (FPGA-dependent configuration) | — |
| Transceiver Data Rate | Up to 6.375 Gbps | — |
| العلبة | 780-ball FineLine BGA (F780) | 780-ball FBGA (29 x 29 mm, 1.0 mm pitch) |
| Speed Grade | C6 (commercial, mid-speed) | — |
| درجة حرارة التشغيل | 0C to +85C (commercial) | — |
| Core Voltage | 1.2 V (typical) | — |
| Configuration Mode | Enhanced passive/active (EPC) supported | — |
| Process Technology | 90 nm | 90 nm CMOS |
| حالة RoHS | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS compliance status] |
| Lead-Free | [DATA_NEEDED: lead-free status] | [DATA_NEEDED: lead-free status] |
| Logic Elements | — | 33,880 |
| Logic Cells / CLBs | — | 33,880 |
| Maximum Internal Frequency | — | 622.08 MHz |
| Core Supply Voltage (VCCINT) | — | 1.15 V to 1.25 V |
| Operating Temperature Grade | — | Industrial (-40 °C to +85 °C) |
| Terminal Form | — | Ball (BGA) |
| Package Code | — | BGA (FineLine FBGA) |
| Number of Pins / Balls | — | 780 |
| Logic Family | — | CMOS |
| مستوى MSL | — | [DATA_NEEDED: MSL rating] |