EP2SGX30DF780C4 vs EP2SGX30DF780C5N 比較

詳細並排比較 EP2SGX30DF780C4 由 Intel 與 EP2SGX30DF780C5N 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

Intel
EP2SGX30DF780C5N EP2SGX30DF780C5N - Stratix II GX FPGA, 33.88k LE, 780-FBGA | Intel

EP2SGX30DF780C5N - Stratix II GX FPGA, 33.88k LE, 780-FBGA | Intel

EP2SGX30DF780C5N ⚠ 最後購買機會

規格比較

參數 EP2SGX30DF780C4 EP2SGX30DF780C5N
品牌 Intel Intel
類別 FPGA & CPLD FPGA & CPLD
生命週期狀態 停產終止 最後購買
Family Stratix II GX —
Logic Elements 33,880 —
Logic Cells 33,880 —
Number of LABs / CLBs 1,694 —
Total Number of I/Os 361 —
Maximum Operating Frequency 717 MHz —
Number of Transceivers 20 (embedded multi-gigabit) —
Core Voltage 1.2 V 1.2 V
封裝 FBGA-780 (780-FBGA, 29 x 29 mm, 1 mm pitch) —
安裝類型 Surface Mount Surface Mount
Process Technology 90 nm CMOS 90 nm CMOS
Operating Temperature Grade Commercial (C4) —
Programmable Terminals BGA ball grid (780 terminals) —
Package Code BGA —
Package Shape Square —
MSL 等級 [DATA_NEEDED: MSL level] [DATA_NEEDED: MSL level]
RoHS 狀態 Compliant (per manufacturer product page) Compliant (lead-free finish)
Lead-Free Yes —
Series — Stratix® II GX
Family Name — Stratix II GX
Logic Elements / Cells — 33,880
LABs / CLBs — 1,694
Total RAM Bits — 1,369,728
User I/O Count — 361
Package Type — FC-FBGA-780
Package Size — 29 mm x 29 mm
Ball Pitch — 1.0 mm
工作溫度 — -40°C to +85°C (extended commercial)
Internal Frequency (max) — 622 MHz
Speed Grade — C5
Design Tool — Quartus II

資料表與資源

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