EP2SGX30DF780C5N vs EP2SGX30DF780C7 Comparison

Detailed side-by-side comparison of EP2SGX30DF780C5N by Intel and EP2SGX30DF780C7 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EP2SGX30DF780C5N EP2SGX30DF780C7
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Last Time Buy Obsolete
Series Stratix® II GX Stratix II GX
Family Name Stratix II GX —
Logic Elements / Cells 33,880 —
LABs / CLBs 1,694 —
Total RAM Bits 1,369,728 —
User I/O Count 361 —
Package Type FC-FBGA-780 —
Package Size 29 mm x 29 mm —
Ball Pitch 1.0 mm —
Operating Temperature -40°C to +85°C (extended commercial) 0C to +85C (Commercial)
Core Voltage 1.2 V —
Internal Frequency (max) 622 MHz —
Process Technology 90 nm CMOS —
RoHS Status Compliant (lead-free finish) [DATA_NEEDED: RoHS status]
Mounting Type Surface Mount —
MSL Level [DATA_NEEDED: MSL level] —
Speed Grade C5 -7
Design Tool Quartus II —
Family — Stratix II GX
Logic Elements (LE) — 33,880
Embedded Memory (bits) — 1,369,728
Memory Blocks — 482 (M512/M4K/M-RAM)
DSP Blocks — 24
18x18 Multipliers — 192
Maximum User I/O — 361
Package — 780-Ball FBGA (DF780), 1.0 mm pitch
Process Node — 90 nm
Core Voltage (VCCINT) — 1.2 V (typ)
Configuration — PS / FPP / JTAG
Transceiver Data Rate — [DATA_NEEDED: SERDES data rate]

Datasheets & Resources

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