EP2SGX30DF780C5N vs EP2SGX30DF780C7 比較

詳細並排比較 EP2SGX30DF780C5N 由 Intel 與 EP2SGX30DF780C7 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況,以找出最符合您設計需求的元件。

Intel
EP2SGX30DF780C5N EP2SGX30DF780C5N - Stratix II GX FPGA, 33.88k LE, 780-FBGA | Intel

EP2SGX30DF780C5N - Stratix II GX FPGA, 33.88k LE, 780-FBGA | Intel

EP2SGX30DF780C5N ⚠ 最後購買機會

規格比較

參數 EP2SGX30DF780C5N EP2SGX30DF780C7
品牌 Intel Intel
類別 FPGA & CPLD FPGA & CPLD
生命週期狀態 最後購買 Obsolete
Series Stratix® II GX Stratix II GX
Family Name Stratix II GX —
Logic Elements / Cells 33,880 —
LABs / CLBs 1,694 —
Total RAM Bits 1,369,728 —
User I/O Count 361 —
Package Type FC-FBGA-780 —
Package Size 29 mm x 29 mm —
Ball Pitch 1.0 mm —
工作溫度 -40°C to +85°C (extended commercial) 0C to +85C (Commercial)
Core Voltage 1.2 V —
Internal Frequency (max) 622 MHz —
Process Technology 90 nm CMOS —
RoHS 狀態 Compliant (lead-free finish) [DATA_NEEDED: RoHS status]
安裝類型 Surface Mount —
MSL 等級 [DATA_NEEDED: MSL level] —
Speed Grade C5 -7
Design Tool Quartus II —
Family — Stratix II GX
Logic Elements (LE) — 33,880
Embedded Memory (bits) — 1,369,728
Memory Blocks — 482 (M512/M4K/M-RAM)
DSP Blocks — 24
18x18 Multipliers — 192
Maximum User I/O — 361
封裝 — 780-Ball FBGA (DF780), 1.0 mm pitch
Process Node — 90 nm
Core Voltage (VCCINT) — 1.2 V (typ)
Configuration — PS / FPP / JTAG
Transceiver Data Rate — [DATA_NEEDED: SERDES data rate]

資料表與資源

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