EP2SGX60EF1152I3 vs EP2SGX60EF1152C3N Comparison

Detailed side-by-side comparison of EP2SGX60EF1152I3 by Intel and EP2SGX60EF1152C3N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EP2SGX60EF1152I3 EP2SGX60EF1152C3N
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Obsolete Obsolete
Stock Status In Stock In Stock
Unit Price (USD) $365.00 $2,195.00
Family Stratix II GX Stratix II GX
Series EP2SGX60 Stratix II
Logic Elements (LEs) 60,440 β€”
Adaptive Logic Modules (ALMs) 30,220 (estimated from LEs) 30,220
Equivalent Logic Cells (CLBs) 60,440 β€”
Embedded Memory (Bits) 2,544,192 bits (per DigiKey listing for the I4N variant) β€”
Maximum Internal Frequency 717 MHz 717 MHz
Combinational Delay (per CLB) 2.99 ns β€”
Multi-Gigabit Transceivers [DATA_NEEDED: exact count for EP2SGX60] β€”
Maximum Transceiver Data Rate 6.375 Gbps (per Stratix II GX family spec) β€”
Total RAM Bits 2,544,192 bits β€”
Package 1152-ball FBGA, 35 mm x 35 mm, 1 mm pitch 1152-BBGA (FC-FBGA) 35 x 35 mm, 1.0 mm pitch
Pin/Ball Count 1152 β€”
Mounting Type Surface Mount (BGA) Surface Mount (BGA)
Operating Temperature -40C to +100C (Industrial, I3 speed grade) 0C to +85C (commercial)
Speed Grade I3 (Industrial) C3 (commercial, -3 bin)
Configuration Mode Enhanced (EPC) - fast parallel via external memory β€”
Process Technology 90 nm CMOS 90 nm CMOS
RoHS Status [DATA_NEEDED: not in retrieved snippets] β€”
Logic Elements β€” 60,440
Logic Array Blocks (LABs) β€” 3022
Embedded Memory (bits) β€” 2,544,192
Maximum User I/Os β€” 534
Core Voltage (Vcc) β€” 1.2 V
Propagation Delay β€” 0.40 ns
Embedded Multipliers (18x18) β€” [DATA_NEEDED: embedded multiplier count]
PLLs β€” 4
Transceiver Data Rate β€” 3.125 Gbps per channel

Datasheets & Resources

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