EP2SGX60EF1152I3 vs EP2SGX60EF1152C3N Vergleich

Detaillierter Direktvergleich von EP2SGX60EF1152I3 von Intel und EP2SGX60EF1152C3N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Spezifikationsvergleich

Parameter EP2SGX60EF1152I3 EP2SGX60EF1152C3N
Marke Intel Intel
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus Obsolete Obsolete
Lagerstatus In Stock In Stock
Stückpreis (USD) $365,00 $2.195,00
Family Stratix II GX Stratix II GX
Series EP2SGX60 Stratix II
Logic Elements (LEs) 60,440 —
Adaptive Logic Modules (ALMs) 30,220 (estimated from LEs) 30,220
Equivalent Logic Cells (CLBs) 60,440 —
Embedded Memory (Bits) 2,544,192 bits (per DigiKey listing for the I4N variant) —
Maximum Internal Frequency 717 MHz 717 MHz
Combinational Delay (per CLB) 2.99 ns —
Multi-Gigabit Transceivers [DATA_NEEDED: exact count for EP2SGX60] —
Maximum Transceiver Data Rate 6.375 Gbps (per Stratix II GX family spec) —
Total RAM Bits 2,544,192 bits —
Gehäuse 1152-ball FBGA, 35 mm x 35 mm, 1 mm pitch 1152-BBGA (FC-FBGA) 35 x 35 mm, 1.0 mm pitch
Pin/Ball Count 1152 —
Montageart Surface Mount (BGA) Surface Mount (BGA)
Betriebstemperatur -40C to +100C (Industrial, I3 speed grade) 0C to +85C (commercial)
Speed Grade I3 (Industrial) C3 (commercial, -3 bin)
Configuration Mode Enhanced (EPC) - fast parallel via external memory —
Process Technology 90 nm CMOS 90 nm CMOS
RoHS-Status [DATA_NEEDED: not in retrieved snippets] —
Logic Elements — 60,440
Logic Array Blocks (LABs) — 3022
Embedded Memory (bits) — 2,544,192
Maximum User I/Os — 534
Core Voltage (Vcc) — 1.2 V
Propagation Delay — 0.40 ns
Embedded Multipliers (18x18) — [DATA_NEEDED: embedded multiplier count]
PLLs — 4
Transceiver Data Rate — 3.125 Gbps per channel

Datenblätter & Ressourcen

Alle Produkte durchsuchen BOM erstellen Angebot anfordern