EP3C10E144I7 vs EP3C16E144I7 Comparison
Detailed side-by-side comparison of EP3C10E144I7 by Intel and EP3C16E144I7 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EP3C10E144I7 | EP3C16E144I7 |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Active | Active |
| Series | Cyclone III | — |
| Manufacturer | Intel (formerly Altera) | — |
| Logic Elements | 10,320 | — |
| Total Memory Bits | 423,936 | — |
| Embedded Multipliers (18x18) | 23 | — |
| User I/O Count | 94 | — |
| PLLs | 4 | — |
| Process Technology | 65 nm | — |
| Operating Voltage (Core) | 1.2 V | — |
| Package | 144-pin LQFP Exposed Pad (EQFP) | 144-LQFP Exposed Pad |
| Mounting Type | Surface Mount | Surface Mount |
| Operating Temperature | -40C to +100C (Industrial) | — |
| Grade | Industrial (I7) | — |
| Configuration Modes | JTAG, Active Serial, Active Parallel | — |
| RoHS Status | Compliant (lead-free) | [DATA_NEEDED: RoHS status] |
| Device Type | — | Field Programmable Gate Array (FPGA) |
| FPGA Family | — | Cyclone III |
| Logic Cells | — | 15,408 |
| I/O Count | — | 84 |
| Package Code | — | LFQFP |
| Package Body Size | — | 20 x 20 mm |
| Package Pitch | — | 0.40 mm |
| Pin Count | — | 144 |
| Terminal Type | — | Gull wing |
| Package Shape | — | Square |
| Temperature Grade | — | Industrial |
| Embedded Memory | — | [DATA_NEEDED: embedded memory specification] |
| Core Supply Voltage | — | [DATA_NEEDED: core supply voltage] |
| I/O Supply Voltage | — | [DATA_NEEDED: I/O supply voltage] |
| Operating Temperature Range | — | [DATA_NEEDED: operating temperature range] |
| Configuration Interface | — | [DATA_NEEDED: configuration interface] |