EP3C10E144I7 vs EP3C16E144I7 Vergleich
Detaillierter Direktvergleich von EP3C10E144I7 von Intel und EP3C16E144I7 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP3C10E144I7 | EP3C16E144I7 |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Series | Cyclone III | — |
| Manufacturer | Intel (formerly Altera) | — |
| Logic Elements | 10,320 | — |
| Total Memory Bits | 423,936 | — |
| Embedded Multipliers (18x18) | 23 | — |
| User I/O Count | 94 | — |
| PLLs | 4 | — |
| Process Technology | 65 nm | — |
| Operating Voltage (Core) | 1.2 V | — |
| Gehäuse | 144-pin LQFP Exposed Pad (EQFP) | 144-LQFP Exposed Pad |
| Montageart | Surface Mount | Surface Mount |
| Betriebstemperatur | -40C to +100C (Industrial) | — |
| Grade | Industrial (I7) | — |
| Configuration Modes | JTAG, Active Serial, Active Parallel | — |
| RoHS-Status | Compliant (lead-free) | [DATA_NEEDED: RoHS status] |
| Device Type | — | Field Programmable Gate Array (FPGA) |
| FPGA Family | — | Cyclone III |
| Logic Cells | — | 15,408 |
| I/O Count | — | 84 |
| Package Code | — | LFQFP |
| Package Body Size | — | 20 x 20 mm |
| Package Pitch | — | 0.40 mm |
| Pin-Anzahl | — | 144 |
| Terminal Type | — | Gull wing |
| Package Shape | — | Square |
| Temperature Grade | — | Industrial |
| Embedded Memory | — | [DATA_NEEDED: embedded memory specification] |
| Core Supply Voltage | — | [DATA_NEEDED: core supply voltage] |
| I/O Supply Voltage | — | [DATA_NEEDED: I/O supply voltage] |
| Betriebstemperaturbereich | — | [DATA_NEEDED: operating temperature range] |
| Configuration Interface | — | [DATA_NEEDED: configuration interface] |