EP3C10E144I7 vs EP3C16E144I7 Comparación
Comparación detallada lado a lado de EP3C10E144I7 por Intel y EP3C16E144I7 por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP3C10E144I7 | EP3C16E144I7 |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Series | Cyclone III | — |
| Manufacturer | Intel (formerly Altera) | — |
| Logic Elements | 10,320 | — |
| Total Memory Bits | 423,936 | — |
| Embedded Multipliers (18x18) | 23 | — |
| User I/O Count | 94 | — |
| PLLs | 4 | — |
| Process Technology | 65 nm | — |
| Operating Voltage (Core) | 1.2 V | — |
| Encapsulado | 144-pin LQFP Exposed Pad (EQFP) | 144-LQFP Exposed Pad |
| Tipo de montaje | Surface Mount | Surface Mount |
| Temperatura de funcionamiento | -40C to +100C (Industrial) | — |
| Grade | Industrial (I7) | — |
| Configuration Modes | JTAG, Active Serial, Active Parallel | — |
| Estado RoHS | Compliant (lead-free) | [DATA_NEEDED: RoHS status] |
| Device Type | — | Field Programmable Gate Array (FPGA) |
| FPGA Family | — | Cyclone III |
| Logic Cells | — | 15,408 |
| I/O Count | — | 84 |
| Package Code | — | LFQFP |
| Package Body Size | — | 20 x 20 mm |
| Package Pitch | — | 0.40 mm |
| Recuento de pines | — | 144 |
| Terminal Type | — | Gull wing |
| Package Shape | — | Square |
| Temperature Grade | — | Industrial |
| Embedded Memory | — | [DATA_NEEDED: embedded memory specification] |
| Core Supply Voltage | — | [DATA_NEEDED: core supply voltage] |
| I/O Supply Voltage | — | [DATA_NEEDED: I/O supply voltage] |
| Rango de temperatura de funcionamiento | — | [DATA_NEEDED: operating temperature range] |
| Configuration Interface | — | [DATA_NEEDED: configuration interface] |