EP3C10F256C6 vs EP3C10F256I7 Comparison

Detailed side-by-side comparison of EP3C10F256C6 by Intel and EP3C10F256I7 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EP3C10F256C6 EP3C10F256I7
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active NRND
Family Cyclone III —
Logic Elements (LE) 10,320 —
Total Memory Bits 423,936 bits —
Embedded 18x18 Multipliers 23 —
PLLs 2 —
Maximum User I/Os 182 —
Package 256-FBGA (FineLine BGA, 17x17 mm, 1.0 mm pitch) —
Mounting Type Surface Mount (BGA) Surface Mount
Core Voltage (VCCINT) 1.15 V to 1.25 V (typ. 1.2 V) —
I/O Voltage (VCCIO) 1.2 V to 3.3 V (bank-dependent) —
Process Technology 60 nm low-power CMOS —
Configuration Memory SRAM-based (external EPCS flash required) —
Operating Temperature -40 C to +125 C (industrial, suffix 'C') -40°C to +125°C
Speed Grade 6 —
RoHS Status Compliant (lead-free FBGA) [DATA_NEEDED: RoHS status]
MSL Level 3 (168 hours) —
Device Type — Cyclone III Field Programmable Gate Array (FPGA)
Logic Cells — 10,320 logic cells
Embedded Memory — 423,936 bits
I/O Count — 182 I/O pins
Total Terminals — 256 terminals
Package Type — 256-LBGA
Package Family — LBGA
Package Shape — Square
Terminal Form — Ball
Temperature Grade — Industrial
Supply Voltage — [DATA_NEEDED: supply voltage range]
Core Voltage — [DATA_NEEDED: core voltage]
I/O Standard — [DATA_NEEDED: supported I/O standards]
Configuration Interface — [DATA_NEEDED: configuration interfaces]
Lead-Free Status — Lead Free
REACH Status — [DATA_NEEDED: REACH status]
Manufacturer Family — Cyclone III
Logic Block Count — 10,320 logic blocks

Datasheets & Resources

Browse All Products Create BOM Request Quote