EP3C10F256C6 vs EP3C10F256I7 Vergleich

Detaillierter Direktvergleich von EP3C10F256C6 von Intel und EP3C10F256I7 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Spezifikationsvergleich

Parameter EP3C10F256C6 EP3C10F256I7
Marke Intel Intel
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus Aktiv NRND
Family Cyclone III —
Logic Elements (LE) 10,320 —
Total Memory Bits 423,936 bits —
Embedded 18x18 Multipliers 23 —
PLLs 2 —
Maximum User I/Os 182 —
Gehäuse 256-FBGA (FineLine BGA, 17x17 mm, 1.0 mm pitch) —
Montageart Surface Mount (BGA) Surface Mount
Core Voltage (VCCINT) 1.15 V to 1.25 V (typ. 1.2 V) —
I/O Voltage (VCCIO) 1.2 V to 3.3 V (bank-dependent) —
Process Technology 60 nm low-power CMOS —
Configuration Memory SRAM-based (external EPCS flash required) —
Betriebstemperatur -40 C to +125 C (industrial, suffix 'C') -40°C to +125°C
Speed Grade 6 —
RoHS-Status Compliant (lead-free FBGA) [DATA_NEEDED: RoHS status]
MSL-Level 3 (168 hours) —
Device Type — Cyclone III Field Programmable Gate Array (FPGA)
Logic Cells — 10,320 logic cells
Embedded Memory — 423,936 bits
I/O Count — 182 I/O pins
Total Terminals — 256 terminals
Package Type — 256-LBGA
Package Family — LBGA
Package Shape — Square
Terminal Form — Ball
Temperature Grade — Industrial
Versorgungsspannung — [DATA_NEEDED: supply voltage range]
Core Voltage — [DATA_NEEDED: core voltage]
I/O Standard — [DATA_NEEDED: supported I/O standards]
Configuration Interface — [DATA_NEEDED: configuration interfaces]
Lead-Free Status — Lead Free
REACH Status — [DATA_NEEDED: REACH status]
Manufacturer Family — Cyclone III
Logic Block Count — 10,320 logic blocks

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