EP3C10F256I7 vs EP3C10F256I7N Comparison

Detailed side-by-side comparison of EP3C10F256I7 by Intel and EP3C10F256I7N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EP3C10F256I7 EP3C10F256I7N
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status NRND Active
Device Type Cyclone III Field Programmable Gate Array (FPGA) FPGA
Logic Cells 10,320 logic cells —
Embedded Memory 423,936 bits 423,936 bits
I/O Count 182 I/O pins —
Total Terminals 256 terminals —
Package Type 256-LBGA —
Package Family LBGA —
Package Shape Square —
Mounting Type Surface Mount Surface Mount
Terminal Form Ball —
Operating Temperature -40°C to +125°C -40C to +125C (Industrial)
Temperature Grade Industrial —
Supply Voltage [DATA_NEEDED: supply voltage range] —
Core Voltage [DATA_NEEDED: core voltage] 1.2 V
I/O Standard [DATA_NEEDED: supported I/O standards] —
Configuration Interface [DATA_NEEDED: configuration interfaces] —
Lead-Free Status Lead Free —
RoHS Status [DATA_NEEDED: RoHS status] Compliant
REACH Status [DATA_NEEDED: REACH status] —
Manufacturer Family Cyclone III —
Logic Block Count 10,320 logic blocks —
Family — Cyclone III
Logic Elements (LE) — 10,320
Logic Blocks — 10,320
Total Memory Bits — 423,936
Maximum User I/O — 182
Embedded 18x18 Multipliers — 46
PLLs — 2
Process Technology — 65 nm
Package — 256-LBGA (FineLine BGA)
Lead Free — Yes
MSL Level — 3

Datasheets & Resources

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