EP3C10F256I7 vs EP3C10F256I7N Vergleich
Detaillierter Direktvergleich von EP3C10F256I7 von Intel und EP3C10F256I7N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP3C10F256I7 | EP3C10F256I7N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | NRND | Aktiv |
| Device Type | Cyclone III Field Programmable Gate Array (FPGA) | FPGA |
| Logic Cells | 10,320 logic cells | — |
| Embedded Memory | 423,936 bits | 423,936 bits |
| I/O Count | 182 I/O pins | — |
| Total Terminals | 256 terminals | — |
| Package Type | 256-LBGA | — |
| Package Family | LBGA | — |
| Package Shape | Square | — |
| Montageart | Surface Mount | Surface Mount |
| Terminal Form | Ball | — |
| Betriebstemperatur | -40°C to +125°C | -40C to +125C (Industrial) |
| Temperature Grade | Industrial | — |
| Versorgungsspannung | [DATA_NEEDED: supply voltage range] | — |
| Core Voltage | [DATA_NEEDED: core voltage] | 1.2 V |
| I/O Standard | [DATA_NEEDED: supported I/O standards] | — |
| Configuration Interface | [DATA_NEEDED: configuration interfaces] | — |
| Lead-Free Status | Lead Free | — |
| RoHS-Status | [DATA_NEEDED: RoHS status] | Compliant |
| REACH Status | [DATA_NEEDED: REACH status] | — |
| Manufacturer Family | Cyclone III | — |
| Logic Block Count | 10,320 logic blocks | — |
| Family | — | Cyclone III |
| Logic Elements (LE) | — | 10,320 |
| Logic Blocks | — | 10,320 |
| Total Memory Bits | — | 423,936 |
| Maximum User I/O | — | 182 |
| Embedded 18x18 Multipliers | — | 46 |
| PLLs | — | 2 |
| Process Technology | — | 65 nm |
| Gehäuse | — | 256-LBGA (FineLine BGA) |
| Lead Free | — | Yes |
| MSL-Level | — | 3 |