EP3C10F256I7 vs EP3C10F256I7N Comparación
Comparación detallada lado a lado de EP3C10F256I7 por Intel y EP3C10F256I7N por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP3C10F256I7 | EP3C10F256I7N |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | NRND | Activo |
| Device Type | Cyclone III Field Programmable Gate Array (FPGA) | FPGA |
| Logic Cells | 10,320 logic cells | — |
| Embedded Memory | 423,936 bits | 423,936 bits |
| I/O Count | 182 I/O pins | — |
| Total Terminals | 256 terminals | — |
| Package Type | 256-LBGA | — |
| Package Family | LBGA | — |
| Package Shape | Square | — |
| Tipo de montaje | Surface Mount | Surface Mount |
| Terminal Form | Ball | — |
| Temperatura de funcionamiento | -40°C to +125°C | -40C to +125C (Industrial) |
| Temperature Grade | Industrial | — |
| Tensión de alimentación | [DATA_NEEDED: supply voltage range] | — |
| Core Voltage | [DATA_NEEDED: core voltage] | 1.2 V |
| I/O Standard | [DATA_NEEDED: supported I/O standards] | — |
| Configuration Interface | [DATA_NEEDED: configuration interfaces] | — |
| Lead-Free Status | Lead Free | — |
| Estado RoHS | [DATA_NEEDED: RoHS status] | Compliant |
| REACH Status | [DATA_NEEDED: REACH status] | — |
| Manufacturer Family | Cyclone III | — |
| Logic Block Count | 10,320 logic blocks | — |
| Family | — | Cyclone III |
| Logic Elements (LE) | — | 10,320 |
| Logic Blocks | — | 10,320 |
| Total Memory Bits | — | 423,936 |
| Maximum User I/O | — | 182 |
| Embedded 18x18 Multipliers | — | 46 |
| PLLs | — | 2 |
| Process Technology | — | 65 nm |
| Encapsulado | — | 256-LBGA (FineLine BGA) |
| Lead Free | — | Yes |
| Nivel MSL | — | 3 |