EP3C16E144C8N vs EP3C16E144C7 Comparison

Detailed side-by-side comparison of EP3C16E144C8N by Intel and EP3C16E144C7 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EP3C16E144C8N EP3C16E144C7
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active Active
Family Cyclone III —
Logic Elements (LEs) 15,408 —
Total Memory Bits 516,096 bits (63 Kbytes) —
Embedded Memory Blocks M9K —
Embedded 18x18 Multipliers 56 —
User I/O Pins 84 —
Phase-Locked Loops (PLLs) 4 —
Process Technology 65 nm —
Core Voltage 1.2 V —
Operating Temperature (Commercial) 0C to +85C —
Package 144-LQFP Exposed Pad (EQFP-144) 144-LQFP Exposed Pad
Speed Grade C8 —
Mounting Type Surface Mount Surface mount
RoHS Status Compliant [DATA_NEEDED: RoHS status]
Configuration Memory SRAM-based (volatile) —
Device Type — Cyclone III Field Programmable Gate Array (FPGA)
User I/O Count — 84 I/O
Reported Embedded Memory — 516096 bit
Additional Reported Device Data — 15408; parameter definition [DATA_NEEDED: definition of the reported 15408 value]
Number of Terminals — 144 terminals
Package Code — LFQFP
Package Shape — Square
Terminal Form — Gull wing
Logic Elements — [DATA_NEEDED: logic element count]
Core Supply Voltage — [DATA_NEEDED: core supply voltage]
I/O Supply Voltage — [DATA_NEEDED: I/O supply voltage]
Operating Temperature Range — [DATA_NEEDED: operating temperature range]
Exposed Pad Dimensions — [DATA_NEEDED: exposed pad dimensions]
Package Dimensions — [DATA_NEEDED: package body dimensions]
REACH Status — [DATA_NEEDED: REACH status]
AEC-Q100 Qualification — [DATA_NEEDED: AEC-Q100 qualification status]

Datasheets & Resources

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