EP3C16E144C8N vs EP3C16E144C7 Vergleich

Detaillierter Direktvergleich von EP3C16E144C8N von Intel und EP3C16E144C7 von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

Spezifikationsvergleich

Parameter EP3C16E144C8N EP3C16E144C7
Marke Intel Intel
Kategorie FPGA & CPLD FPGA & CPLD
Lebenszyklusstatus Aktiv Aktiv
Family Cyclone III —
Logic Elements (LEs) 15,408 —
Total Memory Bits 516,096 bits (63 Kbytes) —
Embedded Memory Blocks M9K —
Embedded 18x18 Multipliers 56 —
User I/O Pins 84 —
Phase-Locked Loops (PLLs) 4 —
Process Technology 65 nm —
Core Voltage 1.2 V —
Operating Temperature (Commercial) 0C to +85C —
Gehäuse 144-LQFP Exposed Pad (EQFP-144) 144-LQFP Exposed Pad
Speed Grade C8 —
Montageart Surface Mount Surface mount
RoHS-Status Compliant [DATA_NEEDED: RoHS status]
Configuration Memory SRAM-based (volatile) —
Device Type — Cyclone III Field Programmable Gate Array (FPGA)
User I/O Count — 84 I/O
Reported Embedded Memory — 516096 bit
Additional Reported Device Data — 15408; parameter definition [DATA_NEEDED: definition of the reported 15408 value]
Number of Terminals — 144 terminals
Package Code — LFQFP
Package Shape — Square
Terminal Form — Gull wing
Logic Elements — [DATA_NEEDED: logic element count]
Core Supply Voltage — [DATA_NEEDED: core supply voltage]
I/O Supply Voltage — [DATA_NEEDED: I/O supply voltage]
Betriebstemperaturbereich — [DATA_NEEDED: operating temperature range]
Exposed Pad Dimensions — [DATA_NEEDED: exposed pad dimensions]
Package Dimensions — [DATA_NEEDED: package body dimensions]
REACH Status — [DATA_NEEDED: REACH status]
AEC-Q100 Qualification — [DATA_NEEDED: AEC-Q100 qualification status]

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