EP3C16E144C8N vs EP3C16E144C7 对比

详细并排对比 EP3C16E144C8N 出自 Intel 和 EP3C16E144C7 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

规格对比

参数 EP3C16E144C8N EP3C16E144C7
品牌 Intel Intel
分类 FPGA & CPLD FPGA & CPLD
生命周期状态 有效 有效
Family Cyclone III —
Logic Elements (LEs) 15,408 —
Total Memory Bits 516,096 bits (63 Kbytes) —
Embedded Memory Blocks M9K —
Embedded 18x18 Multipliers 56 —
User I/O Pins 84 —
Phase-Locked Loops (PLLs) 4 —
Process Technology 65 nm —
Core Voltage 1.2 V —
Operating Temperature (Commercial) 0C to +85C —
封装 144-LQFP Exposed Pad (EQFP-144) 144-LQFP Exposed Pad
Speed Grade C8 —
安装类型 Surface Mount Surface mount
RoHS 状态 Compliant [DATA_NEEDED: RoHS status]
Configuration Memory SRAM-based (volatile) —
Device Type — Cyclone III Field Programmable Gate Array (FPGA)
User I/O Count — 84 I/O
Reported Embedded Memory — 516096 bit
Additional Reported Device Data — 15408; parameter definition [DATA_NEEDED: definition of the reported 15408 value]
Number of Terminals — 144 terminals
Package Code — LFQFP
Package Shape — Square
Terminal Form — Gull wing
Logic Elements — [DATA_NEEDED: logic element count]
Core Supply Voltage — [DATA_NEEDED: core supply voltage]
I/O Supply Voltage — [DATA_NEEDED: I/O supply voltage]
工作温度范围 — [DATA_NEEDED: operating temperature range]
Exposed Pad Dimensions — [DATA_NEEDED: exposed pad dimensions]
Package Dimensions — [DATA_NEEDED: package body dimensions]
REACH Status — [DATA_NEEDED: REACH status]
AEC-Q100 Qualification — [DATA_NEEDED: AEC-Q100 qualification status]

数据手册与资源

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