EP3C16E144I7 vs EP3C16E144C8N Comparison

Detailed side-by-side comparison of EP3C16E144I7 by Intel and EP3C16E144C8N by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EP3C16E144I7 EP3C16E144C8N
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Active Active
Device Type Field Programmable Gate Array (FPGA) —
FPGA Family Cyclone III —
Logic Cells 15,408 —
I/O Count 84 —
Package 144-LQFP Exposed Pad 144-LQFP Exposed Pad (EQFP-144)
Package Code LFQFP —
Package Body Size 20 x 20 mm —
Package Pitch 0.40 mm —
Pin Count 144 —
Terminal Type Gull wing —
Package Shape Square —
Temperature Grade Industrial —
Mounting Type Surface Mount Surface Mount
Embedded Memory [DATA_NEEDED: embedded memory specification] —
Core Supply Voltage [DATA_NEEDED: core supply voltage] —
I/O Supply Voltage [DATA_NEEDED: I/O supply voltage] —
Operating Temperature Range [DATA_NEEDED: operating temperature range] —
Configuration Interface [DATA_NEEDED: configuration interface] —
RoHS Status [DATA_NEEDED: RoHS status] Compliant
Family — Cyclone III
Logic Elements (LEs) — 15,408
Total Memory Bits — 516,096 bits (63 Kbytes)
Embedded Memory Blocks — M9K
Embedded 18x18 Multipliers — 56
User I/O Pins — 84
Phase-Locked Loops (PLLs) — 4
Process Technology — 65 nm
Core Voltage — 1.2 V
Operating Temperature (Commercial) — 0C to +85C
Speed Grade — C8
Configuration Memory — SRAM-based (volatile)

Datasheets & Resources

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