EP3C16E144I7 vs EP3C16E144C8N Comparación
Comparación detallada lado a lado de EP3C16E144I7 por Intel y EP3C16E144C8N por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP3C16E144I7 | EP3C16E144C8N |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Device Type | Field Programmable Gate Array (FPGA) | — |
| FPGA Family | Cyclone III | — |
| Logic Cells | 15,408 | — |
| I/O Count | 84 | — |
| Encapsulado | 144-LQFP Exposed Pad | 144-LQFP Exposed Pad (EQFP-144) |
| Package Code | LFQFP | — |
| Package Body Size | 20 x 20 mm | — |
| Package Pitch | 0.40 mm | — |
| Recuento de pines | 144 | — |
| Terminal Type | Gull wing | — |
| Package Shape | Square | — |
| Temperature Grade | Industrial | — |
| Tipo de montaje | Surface Mount | Surface Mount |
| Embedded Memory | [DATA_NEEDED: embedded memory specification] | — |
| Core Supply Voltage | [DATA_NEEDED: core supply voltage] | — |
| I/O Supply Voltage | [DATA_NEEDED: I/O supply voltage] | — |
| Rango de temperatura de funcionamiento | [DATA_NEEDED: operating temperature range] | — |
| Configuration Interface | [DATA_NEEDED: configuration interface] | — |
| Estado RoHS | [DATA_NEEDED: RoHS status] | Compliant |
| Family | — | Cyclone III |
| Logic Elements (LEs) | — | 15,408 |
| Total Memory Bits | — | 516,096 bits (63 Kbytes) |
| Embedded Memory Blocks | — | M9K |
| Embedded 18x18 Multipliers | — | 56 |
| User I/O Pins | — | 84 |
| Phase-Locked Loops (PLLs) | — | 4 |
| Process Technology | — | 65 nm |
| Core Voltage | — | 1.2 V |
| Operating Temperature (Commercial) | — | 0C to +85C |
| Speed Grade | — | C8 |
| Configuration Memory | — | SRAM-based (volatile) |