EP3C16E144I7 vs EP3C16E144C8N Vergleich
Detaillierter Direktvergleich von EP3C16E144I7 von Intel und EP3C16E144C8N von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Spezifikationsvergleich
| Parameter | EP3C16E144I7 | EP3C16E144C8N |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Aktiv | Aktiv |
| Device Type | Field Programmable Gate Array (FPGA) | — |
| FPGA Family | Cyclone III | — |
| Logic Cells | 15,408 | — |
| I/O Count | 84 | — |
| Gehäuse | 144-LQFP Exposed Pad | 144-LQFP Exposed Pad (EQFP-144) |
| Package Code | LFQFP | — |
| Package Body Size | 20 x 20 mm | — |
| Package Pitch | 0.40 mm | — |
| Pin-Anzahl | 144 | — |
| Terminal Type | Gull wing | — |
| Package Shape | Square | — |
| Temperature Grade | Industrial | — |
| Montageart | Surface Mount | Surface Mount |
| Embedded Memory | [DATA_NEEDED: embedded memory specification] | — |
| Core Supply Voltage | [DATA_NEEDED: core supply voltage] | — |
| I/O Supply Voltage | [DATA_NEEDED: I/O supply voltage] | — |
| Betriebstemperaturbereich | [DATA_NEEDED: operating temperature range] | — |
| Configuration Interface | [DATA_NEEDED: configuration interface] | — |
| RoHS-Status | [DATA_NEEDED: RoHS status] | Compliant |
| Family | — | Cyclone III |
| Logic Elements (LEs) | — | 15,408 |
| Total Memory Bits | — | 516,096 bits (63 Kbytes) |
| Embedded Memory Blocks | — | M9K |
| Embedded 18x18 Multipliers | — | 56 |
| User I/O Pins | — | 84 |
| Phase-Locked Loops (PLLs) | — | 4 |
| Process Technology | — | 65 nm |
| Core Voltage | — | 1.2 V |
| Operating Temperature (Commercial) | — | 0C to +85C |
| Speed Grade | — | C8 |
| Configuration Memory | — | SRAM-based (volatile) |